Electronics Forum | Mon Jan 14 23:02:52 EST 2008 | davef
You don't mention any particular IC or manufacturer or marking method. However, most IC marking is done with lasers these days. The laser actually alters the encapsulation so the only way to erase the marking is to remove the encapsulation. Otherwise
Electronics Forum | Wed May 15 22:23:38 EDT 2002 | ianchan
Hi mates, need some help to resolve a thumb-twine situation. As a high-mix, low volume prototype build house, we always conduct a first article inspection (FAI) on every model setup conversion in the SMT production Lot run. we do this FAI by mounti
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Fri May 27 14:21:27 EDT 2005 | Frank
Back in the day, we had a small solder pot used for dipping ICs that were freshly removed from defective boards. What tool did we use to clean the dross? A small piece of card board. After the card board got too toasted, we'd grab a new piece of c
Electronics Forum | Thu Sep 02 13:01:51 EDT 1999 | John Thorup
| | Certain ICs cannot be place by our pick and place machines and therefore operators place them by hand. Has anyone seen some type of dispensing material handler that would ensure we don't bend the leads of this fragile devices? I'm envisioning som
Electronics Forum | Mon Oct 15 13:13:17 EDT 2001 | MikeF
Adding to Dave's comments, suppliers of selective soldering machines include Air Vac and Wenesco. I've used both, to solder and de-solder larger thru hole parts, such as connectors and large IC's. They are best suited to lower volume applications, an
Electronics Forum | Mon Oct 15 13:13:43 EDT 2001 | MikeF
Adding to Dave's comments, suppliers of selective soldering machines include Air Vac and Wenesco. I've used both, to solder and de-solder larger thru hole parts, such as connectors and large IC's. They are best suited to lower volume applications, an
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc
A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th
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