Electronics Forum: ic wrong orientation cause (Page 1 of 3)

Component orientation

Electronics Forum | Wed Aug 03 20:35:52 EDT 2022 | stephendo

Over simplified generic method. Step 1: make a document with every part shape showing zero orientation. Specify CW or CCW. Step 2: Find every step in the process that does not follow the standardisation and adjust as needed. The best I saw this wor

Component Wrong Orientation

Electronics Forum | Fri Jul 21 11:56:30 EDT 2006 | CKH

Hi Folk, i encounter some components mounted in the different Orientaion (Wrong Orientation). i am puzzle on this.... All these components come in Tape & Reel form. i can only deduce that the Component Wrong Orientation might come from its origina

IC marking unclear after pass reflow

Electronics Forum | Tue Apr 01 09:46:26 EDT 2008 | patsama_n

Thank you for kindness advice. From the result of IC after pass the reflow process. The color of letter will change to similar color of material compound of IC. Then when we inspection by AOI machine, we have many problem about high fault reject rate

software PPS v8.0

Electronics Forum | Mon Sep 13 07:14:34 EDT 2010 | mun4o

Hi all, we have two smd line, with 2 topaz X each.Software for optimizing is PPS v.8.0.The problem is that when PPS optimazing the programme, IC, diodes and other polarity components are with wrong orientation.But, I see the orientation onli when str

Another Wave Solder Question....

Electronics Forum | Thu Jan 24 20:00:24 EST 2002 | davef

If solder touches gold, you should see solder, rather than gold. Since you see gold, something is wrong. * Is the solder touching the gold? If not, why not? * If the solder is touching the gold, but the gold is not soldering, there is a problem w

Solder bridging on IC leads

Electronics Forum | Mon Aug 23 03:12:57 EDT 2010 | grahamcooper22

Possible route causes of bridging on fine pitch ICs are; too much paste (stencil aperture wrong), poor print quality (paste smudges during printing), pcb pads not flat depending on the solderable coating, paste has poor cold slump properties, too muc

Thru-hole placements

Electronics Forum | Tue Feb 23 12:49:10 EST 2010 | gregp

Dilbert is correct. The CS-400E machine is the machine of choice. The component insertions are light guided, the components are automatically presented to the operator and the leads are automatically cut and clinched at programmable lead length and

First Article Inspection

Electronics Forum | Wed May 15 22:23:38 EDT 2002 | ianchan

Hi mates, need some help to resolve a thumb-twine situation. As a high-mix, low volume prototype build house, we always conduct a first article inspection (FAI) on every model setup conversion in the SMT production Lot run. we do this FAI by mounti

Polarity for SMT Devices

Electronics Forum | Tue May 28 09:08:52 EDT 2002 | pjc

Silkscreening is falling out of favor, as it should. SMT IC devices can have their "pin one" solder lands indicated by a round mark, like a fiducial or a "1" mark, both made from either the copper clad PWB material or silkscreened. I have seen some w

FALSE CALL REDUCTION

Electronics Forum | Thu Aug 08 12:01:46 EDT 2024 | proceng1

We relocated an operator from AOI. There were a few issues, but one that really caught the attention of Engineering was that an IC with 4 legs on one side and 3 legs on the other was placed 180° out. The machine flagged it. The operator looked at t

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