Electronics Forum | Wed Jan 04 13:47:11 EST 2006 | russ
To answer your question it was mentioned that allowing the boards to cool slightly between reflow and wash may help this case to eliminate thermal shock from immediately going into colder water straight out of the oven with no cooling. In looking at
Electronics Forum | Wed Jun 30 12:41:25 EDT 2010 | rgduval
In general, if the process has been consistent for a period of time, then one should look at any new variables in the process. Therefore...the supposition that there's a bad lot of components is a very good one. Did Yageo offer any possible explana
Electronics Forum | Thu Sep 03 12:42:50 EDT 1998 | Mike Cox
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Tue Aug 07 21:17:24 EDT 2001 | davef
This provides LT 3 misses /1M hits. * Probe all points on one side of the board. Bonus => This lower fixture cost. * Test pads and vias: GT 25 thou from other land traces. * Small [LT 5 ohm] resistor measurements: Use two pads at each end and do 4-
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Wed Jan 03 11:14:26 EST 2007 | realchunks
What is your biggest failure mode? You root cause problem could be anything from poor ICT fixture to bad incoming inspection. Generally, BGA's are a high yield producing component. Just cause they're neat-o doesn't make em' bad. As for 85% yiel
Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Tue Mar 28 14:35:04 EDT 2017 | emeto
I can't believe there is a topic for discussion. Find a way and measure lead contamination(if any)and prove them wrong. This is getting out of control. Having all the billions of gasoline and diesel engines pumping dirt in the air, together with the
Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy
Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm
Electronics Forum | Tue Dec 17 13:42:04 EST 2002 | robf
There are a few emerging technologies that have been growing in popularity for the past few years. Pin through paste, press fit connectors and selective soldering machines seem to be displacing custom fixtures. Most of the mixed technology boards o
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