Electronics Forum | Tue Jul 18 17:47:02 EDT 2000 | bluto
What kind of ict nail should we use when testing a board that does not go through wave solder? There is no dome shape for our nails to "bite" into, and we are having problems.
Electronics Forum | Tue Jul 18 20:17:25 EDT 2000 | Dave F
Bluto: Either: * Give the springs in your probes some spinach ... OR * Print some paste onto your test pads Popeye
Electronics Forum | Mon Feb 10 14:34:56 EST 2014 | jigo91
Hi, I wanted to know how can we test our paste quality, as viscosity, temperature in which it is delivered to the SMT line and other variables that can affect our paste dispense or soldering. Our concerns are that paste quality may be causing solde
Electronics Forum | Tue Feb 11 12:44:32 EST 2014 | cyber_wolf
Jigo, We have never had a need to do internal testing on solder paste, and your paste supplier should be able to tell you what the correct operating temperature range is. All of the big names in solder paste have tight quality control and I suspect t
Electronics Forum | Mon Feb 10 16:59:57 EST 2014 | hegemon
It is sort of a self answering question if you come in from the solder paste angle. First....start gathering data. Check every day, or every new paste jar, for: Storage conditions (temp), paste expiration date, ambient temp and humidity where yo
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Thu Dec 17 17:34:26 EST 1998 | Earl Moon
| Has any anyone established / published quality standards for BGA solder joints? Is IPC-A-610 in process of adding standards for BGAs? | The debate continues. I have felt for some time a maximum 20% voiding is allowable under certain conditions (w
Electronics Forum | Thu Jul 27 16:54:46 EDT 2006 | pjc
In-Circuit test, or ICT, is the most common method of electrical test for an assembled PCB. It is the most comprehensive and accurate method to ensure that both the PWB and components are working to specification. Not all components however can be el
Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard
Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
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