Electronics Forum | Thu Aug 09 12:36:26 EDT 2001 | Michael Parker
Adam- Mikie here. I too am placing 2 PBGA sockets on an assembly but they aren't mirror imaged. Thanks to the SMT Gods for that one. You say you added more paste to solve for open solder. Do you have x-ray? Were the alignments perfect? Also the part
Electronics Forum | Fri Mar 25 14:33:26 EDT 2011 | davef
IPC-7525 Stencil Design Guidelines
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
Electronics Forum | Fri Mar 25 06:03:40 EDT 2011 | arwankhoiruddin
Thank you for the reply, Davef. I am thinking if I can get the standard rather than "trial and error". If there is no such standard, is there any experience of what is the range for good and acceptable solder paste (e.g. minimum and maximum percenta
Electronics Forum | Wed Mar 23 11:08:36 EDT 2011 | davef
There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making g
Electronics Forum | Wed Aug 01 08:58:02 EDT 2018 | 2219576
Please check the solder paste height near PCB edges, Please check board clamping during solder paste printing. Please check tooling support boards must be fixed during the printing process. try to set wiper cleaning frequency and fine tune for best
Electronics Forum | Fri Sep 13 13:51:38 EDT 2002 | kenbliss
I recently saw an ad in a major trade magazine that stated: �about 60%of all printed circuit board manufacturing defects are due to stencil printing� I would like to hear comments from people that are running SMT lines, is this fact and if it is, w
Electronics Forum | Fri Jul 27 13:51:53 EDT 2018 | vlad_saviuk
Hi, have some question: during solder paste printing I'm faced with problems on the edge of the PCB - solder balls on gold pads. During analisys we checked everything - change squeegee preasure, different cleaning cycles, squeegee speed - no effect.
Electronics Forum | Sun Sep 15 08:35:42 EDT 2002 | davef
That 60+% print defects number has been bantied around for so long in the electronic assembly business for so long that people believe that it's true. One starting point for this myth and lore is: "Where Quality Is Lost On SMT Boards" C Mangin, 'Cir
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
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