Electronics Forum | Fri Mar 30 07:14:42 EST 2001 | pteerink
Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no
Electronics Forum | Fri Mar 30 07:14:51 EST 2001 | pteerink
Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no
Electronics Forum | Tue Mar 18 11:51:24 EST 2003 | slthomas
I like this answer! Part geometry, part mass, land pattern, print accuracy, reflow profile, placment accuracy, and aperture shape all play a role. If you use a homeplate to reduce solder balling, have high profile/low mass parts AND place more to
Electronics Forum | Tue Sep 20 23:12:38 EDT 2005 | darby
Several suggestions. Your hands may be tied but here goes. 1. Doctor your stencil so that pads are not shared etc and reduce the apertures more that what you would normally. This may stop one pad wetting into another etc. 2. The use of a Pb-free sol
Electronics Forum | Wed Aug 27 08:46:14 EDT 2008 | vladig
Hi Sean, It's an old problem with no definitive cure for now. However, there are a couple of things to look for. First of all the location(s) of HoP. If it was due to the componetn warpage, then it would be most probably in the middle and it should
Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
Electronics Forum | Mon Mar 10 10:14:10 EST 2003 | pjc
Most pre-reflow AOI systems today can easily keep up with production line beat rates. Pre or Post reflow AOI is the difference between process control vs. defect screening, in my opinion. Pre reflow repairs cost much less than post. Pre AOI is for
Electronics Forum | Tue Feb 20 21:19:43 EST 2001 | davef
You�re correct, many of us recognize that problems in paste deposition are the source of the majority of SMT component defects. What would you say that the portion of the "51 to 72% of all solder defects are the result of screen-printing problems" t
Electronics Forum | Mon Mar 11 13:11:00 EST 2002 | steve_arneson
I have read all of the previous threads and have found it very hard to believe what I am hearing. The idea that AOI is not needed on your production line is like running a marathon without training before hand. You can only expect to get out of an
Electronics Forum | Wed Jul 25 23:37:11 EDT 2001 | mugen
my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t
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