Electronics Forum | Wed Dec 19 18:41:33 EST 2007 | darby
You printer is not solely designed for printing solder paste. This is why some of the options you would never use for paste appear in the menu. You may actually be printing overlays or yes, even t-shirts. This is why you may want to flood/print, prin
Electronics Forum | Wed Mar 02 09:28:02 EST 2005 | bobsavenger
I am looking for images of solder paste defects like Past stringing, paste gorging and dog ears. I would also like to have the avi file to show how tombstoning happens in the reflow oven. Thanks Bob
Electronics Forum | Thu Apr 28 01:40:14 EDT 2022 | sophyluo1985
Advantages of SPI 1. Reduce defects SPI was first used to reduce defects caused by improperly printed solder paste. Therefore, the primary advantage of SPI is its ability to reduce defects. Defects have always been a major problem when it comes to
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
Electronics Forum | Mon Aug 02 12:28:41 EDT 2010 | tselvan
to prevent solder paste printing defects
Electronics Forum | Mon Oct 03 07:38:36 EDT 2016 | cyber_wolf
We successfully re-print mis-prints all of the time. We have SPI machines at every printer that let us know if it is OK or not. Sometimes dealing with the solder defect is better than cleaning the mis-print. It is very difficult not to wedge solder
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Wed Dec 19 16:53:41 EST 2007 | flipit
Double pass printing for solder paste is not needed and will cause defects. Redesign your stencil thickness or aperture sizes, change your paste mesh size or type, go to 45 degree blades.
Electronics Forum | Thu Dec 20 12:05:46 EST 2007 | realchunks
Not you Steven. Blanket comments like "Double pass printing for solder paste is not needed and will cause defects. Redesign your stencil thickness or aperture sizes, change your paste mesh size or type, go to 45 degree blades." are so way off base.
Electronics Forum | Tue Aug 27 22:07:45 EDT 2002 | davef
Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed circuit board. Mask. A material applied to allow selective etching, plating, or protection of the surface of a printed circuit board.
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