Electronics Forum | Thu Apr 28 01:30:54 EDT 2022 | sophyluo1985
Achieving high reliability and high efficiency in SMT process (Surface Mount Technology) assembly has always been the goal of electronics manufacturers expecting consistency. It depends on the optimization of every detail of the whole process. For SM
Electronics Forum | Thu Mar 25 14:13:13 EST 1999 | Bob Willis
| | I am looking for clip art images of electronics assembly. Images like wave soldering, surface mount components, soldering irons... just general assembly graphics. Many sites have different individual images that they use I was just wondering if
Electronics Forum | Wed Mar 06 12:28:45 EST 2002 | kg
How could you know if your printing process is capable or in control if you don't have a print measurement tool? Still, I suspect it's a myth that 60% of SMT defects are screening defects. Are there data behind these figures or do we just continue
Electronics Forum | Thu Dec 26 12:41:53 EST 2019 | emeto
We agree with your statements. 1. Having manually printed board will compromise your print and you don't know how much paste you have on each pad. 2. LEDs falling off that easily might be related to contamination, considering that your profile is not
Electronics Forum | Sun Sep 09 10:53:05 EDT 2001 | bentzen
For reflow soldering, you are correct ! The higher surface tension of the solder paste in nitrogen atmosphere can increase the number of solder bridges if the component or solder paste print is inaccurate. Another defect that might increase is tomb
Electronics Forum | Tue Sep 04 12:05:52 EDT 2012 | duchoang
cobhambill is right but depend on how bad the defect, and how good your printer is, you can reprint it one more time. I did sometimes with my equipment with no problem. It's hard to clean NO-CLEAN solder-paste properly, specially with panelized PCB w
Electronics Forum | Fri Mar 14 17:41:32 EDT 2008 | jerrysaise
Hello Before I say anything. Here is one caveat, I work for a 3D paste inspection vendor, I will not mention which. So you can take whatever I say with a grain of salt. Paste inspection will make a difference if you want to put the effort into it ma
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Fri May 26 08:16:14 EDT 2006 | Chunks
This could be what we call a "non-problem". If your print is off slightly, yet after reflow there is no solder related defects, it should be considered OK. Move your inspector from the printer to right after the oven. This would enable them to ins
Electronics Forum | Wed May 09 03:29:16 EDT 2001 | Eyal Duzy
Yes, your observation is accurate. Different process steps have different inspection requirements which necessitates employing different imaging technology to ensure the best performance (detection and throughput). Orbotech, for example, offers both
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