Electronics Forum | Sun Sep 15 21:44:41 EDT 2002 | jason
Hi Dave, Immersion Ag has poor surface appearances after reflow or rather tarnished, while Immersion Tin requries higher temp. Probably that's why Immersion Ag is more preferred.
Electronics Forum | Wed Apr 13 07:10:17 EDT 2005 | masters
In addition,how to deal with the misprint immersion Ag PCB?Now,we just remove the paste,clean it,and exposed in air for 2 hours,and then put to use.
Electronics Forum | Wed Mar 16 14:12:19 EST 2005 | KT
We are moving from ENIG to Immersion Ag. We notice PCB's with Ag finish getting more heat(increase in peak temp) than the ENIG. Any reasoning behind this phenomenon ? KT
Electronics Forum | Tue May 07 07:29:24 EDT 2002 | Yannick
Hi, I reaaly mean AG (Like silver) we was thinking about going with immersion gold butis a bit more expensive. we use a no-clean paste but in a few year( maybe 1-2) we suppose to change to a lead free. You said that with Immersion gold we
Electronics Forum | Sun May 12 22:01:44 EDT 2002 | ianchan
Hi mates, since I read about this immersion Ag plated PCB, was wondering if its so damm good, why so few people are using it? and why so long to market its PCBA application-virtues? feedback from bouncing this question around is Ag is prone to corr
Electronics Forum | Tue May 07 07:38:13 EDT 2002 | ianchan
Hi mate, checked with one of our egg-brains in the factory (freakin' workaholic still around at this time of night), he tells me that Ag-based PCB finishings share rather similar reflow temperatures for normal Sn/Pb applications. this means (if he i
Electronics Forum | Fri May 10 01:41:04 EDT 2002 | ianchan
Steve, Hi mate, was doing some text book reading and saw this one paragraph that commented on the PCB fab plating could have residue chemistry inherent in the PCB if the fab process control isn't up to mark. such chemistry could surface to the Au/N
Electronics Forum | Tue Jun 08 08:27:14 EDT 2004 | michaeljm
I would like to see the report from MacDermid. We have samples of ag boards in which the underside of PCB pad has been plated between the PCB laminate and pad.
Electronics Forum | Mon May 13 14:15:46 EDT 2002 | davef
Entek is Enthone's OSP [organic solderability protection]. It is widely used in the PCB fabrication business. Imidazole (Via Systems) is good, but is not as widely available. Search the fine SMTnet Archive on: * OSP * Entek CU-56, Entek Plus CU-10
Electronics Forum | Wed Nov 20 12:14:15 EST 2024 | SMTA-74487602
Thank you for input. Do you bake all PCBs regardless of finish? I spoke with another engineer that says he will bake ENIG at 120 C but not immersion Ag due to it impacting solderability.
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