Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
Electronics Forum | Tue Aug 20 18:15:02 EDT 2002 | davef
Haaaaa!!!! Soldering to plastic!!!! An apt analogy!!! I like to compare it to soldering to dirt. Some thing. In fact, you are soldering on nickel, when soldering on many things. It�s just that the gold, er Pd, flash enables the wetting mechanism
Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Wed Jul 09 16:01:10 EDT 2003 | russ
Mike, the one pad that is "small" definitely appears to be over etching (It looks like it was supposed to be much larger). What is the dims of this little bugger as compared to the Gerber? i would also tend to believe that there probably is some mask
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Fri Aug 26 09:48:11 EDT 2005 | David
I have heard that there are problems using immersion gold on PCBs when working with BGAs. Is this correct? Is white tin more suitable?
Electronics Forum | Fri Aug 26 14:15:16 EDT 2005 | David
Where could I find more information regarding the double sided reflow and flux problems with white tin?
Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May
Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
