Electronics Forum | Thu Sep 17 23:36:35 EDT 2009 | Sean
All, We know that incomplete immersion silver could potentially lead this creeping corrosion. Is there any way to check bare PCB for incomplete immersion silver coverage, especially on the via hole area? Thanks, Sean.
Electronics Forum | Sun Aug 03 08:27:41 EDT 2008 | davef
IPC-4553, Specification for Immersion Silver Plating for Printed Circuit Boards, 1.4.1 Solderability. This primary function of IAg is to provide a solderable surface finish, suitable for all surface mount and through-hole assembly applications and wi
Electronics Forum | Thu Apr 27 10:35:21 EDT 2000 | Russ
Scott, I am a little confused, when you mention "silver thru hole vs. plated through hole what do you mean. A silver "immersion" type finish vs. HASL (Tin lead)on your PCB? Or are you talking about using silver solder to perform intrusive reflow of
Electronics Forum | Tue Oct 22 20:38:50 EDT 2002 | davef
Search the fine SMTmet Archives for background on immersion silver.
Electronics Forum | Fri Aug 04 08:32:07 EDT 2017 | abruno1995
So i am a quality inspector and i am having issues with the immersion silver PCB. I have found the via holes to be somewhat filled and i wanted to know if anyone knew it this is a CLASS 1, 2, 3, ICP DEFECT or what it is at all?
Electronics Forum | Thu Apr 27 11:36:53 EDT 2000 | PeterB
Russ, We also use 'immersion silver' and have not had any impact on our processes. In fact there are a number of benefits i.e very flat pads (as good as electroless nickel/immersion gold but much cheaper and less unfriendly to the environment), good
Electronics Forum | Mon Apr 27 14:39:38 EDT 2015 | davef
Anirudh: When board fabs talk "surface finishing" they're talking about the solderability protection that you'd like on the solderable copper component mounting pads that you laid-out for each component: * Bare copper pads corrode very quickly * Corr
Electronics Forum | Fri Sep 04 07:26:23 EDT 2009 | Sean
Dear Davef, Thanks for sharing with me..I observed this creeping corrosion tend to appear on PCB via hole rather than other PCB location. Why this problem did not appear on PCB traces? Besides, I also notice that this problem only appear on the PC
Electronics Forum | Sat Nov 05 01:22:23 EST 2005 | koeka
All, We are having insufficient hole fill only at DIMM connector area(120 pin/row total two or 4 rows at that area) when we switch to lead free (SAC and Sn/Cu). The finish we using is immersion silver. Preheat on top side ~98-118oC. Rosin flux type.
Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
