Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Thu Apr 14 06:00:01 EDT 2005 | bryan
The shelf life of immersion silver is 6 to 12 months in good storage conditions. The finish is usually coated with a protective layer that inhibits oxidation (like with copper OSP). Care must be taken when handling the boards as the protective la
Electronics Forum | Fri Apr 09 20:28:14 EDT 2004 | Ken
I have experience in this. My company offers Lead free SMT and Wave soldering. I have processed ImSn, ImAg, Enig, OSP in both smt and wave. Yes, silver leaching will occur. Yes, copper leaching will occur. High tin content solders disolve everyt
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
Electronics Forum | Tue Jun 02 17:45:46 EDT 2009 | boardhouse
Hi Nicoleta, As a board shop, either are good choices but in my experience with my customers ENIG has alway been the favorite due to it is easier to work with in regards to not having to tweak your equipment. As long as the board shop that you are u
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Tue Jun 10 16:30:01 EDT 2003 | davef
See, every so often, it's nice to have smart customers. We see no difference between Alpha Level Silver and Mac Dermid Sterling immersion solderability protection. For more discussion search the fine SMTnet Archives, for instance: http://www.smtnet
Electronics Forum | Sun Jun 06 09:20:03 EDT 2004 | michaeljm
My department and I have been working with immersion silver on and off for about four years and we have compiled quite a bit of data for the Alpha and MacDermid immersion silver chemistries. We have not encountered any assembly or storage related is
Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef
There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows
