Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Mon Aug 03 12:18:42 EDT 1998 | John Sikes
We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several ru
Electronics Forum | Mon Nov 25 15:55:32 EST 2002 | davef
Sorry, no tricks for you. The good news is: your reflow recipe should be similar for both imm tin and HASL. Imm tin requires more attention to detail by both the fabricator and the assembler than HASL. There is a fair amount of discussion on imm
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Mon Nov 25 16:12:52 EST 2002 | russ
there is a good article by AIM solder regarding tin. In a nut shell, if you do not apply flux or heat to tin finish you will never degrade it! I agree with the others that you need to check the thickness of the pure tin layer. We have forbidden ti
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
Electronics Forum | Fri Aug 11 14:29:58 EDT 2017 | abruno1995
I am having issues with this. I am having excess plating on my pcb board and i want to know if this is a ICP Class 1-3 Issue. 1. Excess Plating 2. Dark Vias Thank you
Electronics Forum | Thu Aug 31 02:10:42 EDT 2017 | hxamalia
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Electronics Forum | Fri Aug 11 22:14:59 EDT 2017 | dawson
Hi Adonys, What's ICP 1-3? Do you mean IPC? 1. Excess Plating- no excess, but filled with something which generated in the process of copper plating. 2. Dark Vias - it's oxidized. and the solder mask printing is not aligned. The board is failed. M
