Electronics Forum | Fri Aug 17 09:35:15 EDT 2007 | karenp
We usually do Solder reworks, and some components that cannot be installed by SMT Machines or Wave solder due to specs or the technology in our company... aur work methods and instruction are always based on designators and are more illustrated to ca
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
Electronics Forum | Thu Nov 29 13:05:46 EST 2007 | stepheniii
I really hate to ask but must. Are the components that are falling off, the components that don't have glue? Seriously not all the parts on the bottom are glued on? How do they stay on during the wave? The normal way is to run the top SMT as normal
Electronics Forum | Fri Nov 23 07:51:25 EST 2007 | shy
Hi there, kindly help to advice me either epoxy/glue at bottom SMT component such as chip package 2012 will cause the component to be non-wetting after run reflow process?
Electronics Forum | Mon Dec 03 02:44:27 EST 2007 | shy
Hi Loco, If i cover all the SMT component with peel off before reflow, it'll increasing downtime at my production site. To reduce the downtime, we had idea to add in the glue for component package 0805 and bigger.
Electronics Forum | Tue Nov 27 07:36:29 EST 2007 | shy
solder the part is for SMT component (located at top side and bottom side) and wave solder is for THP (located at top side only).
Electronics Forum | Tue Nov 27 06:11:42 EST 2007 | shy
Hi Loco, my PCBA got top side and bottom side and 90% SMT and 10% THP (top side) which need to be cover by wave solder. And that's why i need to go through reflow and wave.
Electronics Forum | Tue Nov 27 08:21:43 EST 2007 | shy
How many mils the gap between the terminal and pad? Your practice is for technology SMT-4? What is problem with glue cure? is it due to the reflow profile? how long the glue can be keep in room temperature with humidity 40-60?
Electronics Forum | Sat Dec 01 22:25:32 EST 2007 | molos21
Shy You should try SMT-5. First solder PTH comps, then apply paste with your pick and place and apply glue with ur screen printer and come back to place smd with pick and place and then reflow. You will get great results. Good luck
Electronics Forum | Sun Dec 02 22:03:14 EST 2007 | shy
Hi Habsfan, if we're mount the THP first, we can't run SMT due to tTHP is tall and big which will causing the PNP to be chaos. Btw, my solder paste location is more than glue location which (solder paste : glue) is 2:1.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
