Electronics Forum | Wed Apr 28 13:33:48 EDT 2004 | Rob
Thanks to all. The way I've been doing it has been crude and very similar to your method. I make an imprint of the bottom side and cut out areas where components sit and this imprint transfers over to a cardboard. When it comes time to run the second
Electronics Forum | Wed Jul 25 09:21:44 EDT 2001 | Stefan Witte
Dave is right that this site has several leads on 0402 placements and tombstoning issues. However, I found a new method of determining the pick position. Remove a component and fill the cavity with silly putty. After attempted pick up you should see
Electronics Forum | Wed Apr 09 11:23:02 EDT 2003 | davef
Nice pix. The pebbly texture that you're seeing is aptly called "orange peel". Temperature appears to significantly influence the appearance of solder spheres during soldering. Indeed, when the reflow temperature is high, tin continues smelting long
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Tue Dec 03 18:51:57 EST 2019 | kylehunter
Hi all, We are having a confusing defect with one of our client's boards. It is a large board, 30" x 12". The client supplies the LEDs, they are cheap overseas diodes, and it is not uncommon to have reels with the packaging torn. We have w
| 1 |
.gif)
winsouce.jpg)