Electronics Forum | Mon Aug 27 19:24:00 EDT 2001 | sharafali
It has been mentioned that DPMO offers large advantages over First Pass yield calculations for measuring process performance!!regarding the same I have a few queries: What are the benchmarks for using DPMO as measures of process performance? How is
Electronics Forum | Mon Dec 03 03:42:15 EST 2001 | ianchan
Hi, actually this point was raised a cuppa times, from the past discussion forums... thats why I posed this questions once again *yawn* to find out any new delvelopments in relation to paste Volume giving accuracy??? Obviously it doesn't seem to h
Electronics Forum | Thu Nov 14 12:11:00 EST 2002 | V.RAMANAND KINI
I am looking for a reflective coating on PCB. I have designed a PCB with SMT type side LEDs and Top LEDs. The light from these LEDs fall on to a lens profile on top of these and get mangnified and reaches the dashboard instrument's pointers. I tried
Electronics Forum | Wed Dec 07 11:56:08 EST 2005 | slthomas
Are you saying you can't send out boards that have been touched up or reworked, or are you saying you can't send out boards with defects on them? 100% is a great goal to shoot for but most people don't expect to achieve it. It all depends on what yo
Electronics Forum | Fri Feb 17 14:54:45 EST 2006 | Baer
We have a great deal of new reliability data and we are preparing a full document that shows the statistically valid reduction in solder related defects as well as the improved throughput. It will include all of the SIR test results which are all goo
Electronics Forum | Tue Jan 15 11:50:17 EST 2008 | pbarton
We too are trialling WS819 with SAC305 alloy. The foaming in cleaning causes us a headache but all other attributes seem much improved over earlier types. Previously we were using WS619 - no foaming issues but MUCH shorter stencil life (less than 4 h
Electronics Forum | Mon Mar 10 20:14:20 EDT 2008 | davef
We'd be unhappy with features that are not in copper that is at the same level as the component pads, because of difficulties the fabricator would have in maintaining registration between the copper pads and the ink used for the features not in coppe
Electronics Forum | Tue May 15 17:24:52 EDT 2012 | jeremymek
Hi Before I say anything I ll qualify who I am. I work for a AOI/SPI manuafacturer Automatic printer is your best option for small runs. Print process is responsible for a vast number of solder defects and improving here is your best start. Have a
Electronics Forum | Sun May 28 23:43:35 EDT 2017 | claire_08
Hi. We provide rework and repair of printed circuit boards to companies all over the world. Key services: BGA Rework Services. BGA Reballing Services. BGA X-Ray Services, Consulting Services. Advanced Technologies R & D Support Services. Hand Sol
Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh
Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi
