Electronics Forum | Tue Jan 13 20:35:52 EST 2004 | davef
ISO9453 and J006 define impurity limits for the materials supplier.
Electronics Forum | Tue Jan 13 12:02:38 EST 2004 | blnorman
We're changing solder bar and wire suppliers and are running impurity tests. Is there an IPC standard that lists acceptable limits for ultra pure, pure, solders for metallic and non-metallic impurities? What is the preferred method to test? We've
Electronics Forum | Fri Jan 16 15:41:23 EST 2004 | patrickbruneel
David, You just provided enough material to start an endless debate in an unexplored field (acceptable impurities, levels and effect on reliability in high tin content (lead free alloys). High tin content alloys have a high affinity to metals like C
Electronics Forum | Sat Jan 17 13:25:04 EST 2004 | bob Willis
I believe this is the only system on the market place and was developed by Panasonic in Japan with Malcolm. As stated it does check a limited number of elements but that was its intention when produced. I believe that only high volume shops would u
Electronics Forum | Tue Mar 02 21:05:38 EST 2004 | Ken
Has anyone in the US used this system? I am told that over 1000 systems are operating world wide...but find it hard to believe no one domestically is using this (if it in fact is worth its salt would more not use it?) Anyone? Anyone demo'd this? A
Electronics Forum | Fri Jan 16 15:31:26 EST 2004 | davef
Bill This drives solder suppliers nuts, because it's not analytic: Dross inclusion testing can be conducted on the base solder in the solder pot and the virgin solder. Conduct this test by heating a sample of solder, contained in a clear beaker,
Electronics Forum | Fri Jan 16 14:24:11 EST 2004 | dwoodrow
We would like to start testing our lead free wave solder machines in house. Mostly looking for lead and copper content. Malcom makes a relatively inexpensive machine that does this (STA-1 http://www.malcomtech.com/products_sta1.html). Does anyone
Electronics Forum | Tue Oct 06 16:50:51 EDT 1998 | Manish
Hello Everybody Would anyone of you know about the impurities in the Ni/Au pad metallurgy (board side metallurgy) affecting the assembly of the chip on the board. I was told that impurities in gold may lead to void formation in the solder bumps.
Electronics Forum | Sun Oct 22 21:18:13 EDT 2000 | Aokilab
This may be the "wetting" problem! Assuming your process parameters are normal (work OK before), the possible reasons: 1. Presence of impurity in the solder; 2. Other impurity (oil or anti-dross) on the surface of the pot; 3. Weak solderability, due
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