Electronics Forum | Tue Dec 27 07:22:44 EST 2005 | davef
It could be lots of things. You're not helping to narrow those alternatives. So, consider taking a sample to: * An analytical laboratory. * Teachers in the chemistry department at a local university. Kester recommends the following independent la
Electronics Forum | Fri Jan 06 09:22:23 EST 2006 | sarar
Here's an article our lab has published about green contamination - http://www.residues.com/pdfs/foresite_green.pdf If you are concerned with finding out just what is there and what the cause is, I would agree with davef that it would be helpful for
Electronics Forum | Wed Sep 10 02:47:49 EDT 2003 | Dennis O'Donnelll
This is a problem of contamination in the plating bath. Most prominent with white tin and some gold over nickel plating processes. Rather than argue with your vendor over the issue, and to avoid future recurring problems, I use either HASL or elect
Electronics Forum | Fri Sep 28 04:49:09 EDT 2007 | gregoryyork
Just a shame that the HASL fluids that are used contain Hydrobromic or hydrochloric acids or a mixture of the two and are full of strong wetting agents that are NON IONIC so the IC test results mean very little as they are checking for Ionics only. P
Electronics Forum | Tue Nov 25 22:25:24 EST 2003 | davef
We had a similar problem on the high impedance front end of a MOSFET amplifier a few years ago. If your situation is like ours, the issue is not what a consensus specification [like J-STD-001] defines as an upper limit, but what your product is defi
Electronics Forum | Mon Jan 21 19:22:38 EST 2008 | davef
In your situation, the issue is the compatibility of your flux residues and the encapsulant that you choose. First, contact your encapsulant supplier for advice. They've likely been down this road with other customers and may be able so save you som
Electronics Forum | Wed Jun 03 01:06:13 EDT 1998 | Mike Moninger
| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al
Electronics Forum | Fri Oct 18 17:04:38 EDT 2002 | ereno
We have a connector mfg that claims that their design is good and does not contribute to the problem that we are having. The problem is evidence of poor soldering. All other components that surround this connector have very good solder joints, with t
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Wed Dec 09 21:45:11 EST 1998 | Dave F
Graham: I agree. Very thorny. What is clean?? And how is that controlled?? Back 25 or so years ago, soldering was done with high solids rosin fluxes. The issue with cleanliness was ionic contamination. The US military and others set a fairly a
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