Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
Electronics Forum | Tue Aug 02 20:12:33 EDT 2022 | cbeneat
So these are XPE's? Are they CM402's or 602's? Are you using custom nozzles? We've had the same issues over the years. We've gotten our custom nozzles from Count on Tools, I actually have 10 new ones on the way. Slowing the placement speed, increasin
Electronics Forum | Wed Aug 03 07:05:46 EDT 2022 | klauss
I got special nozzles, too. but i think i recognize them wrong into the program. Do you please tell me what's the recommended vacuum break time, placement condition keeping time and placement speed
Electronics Forum | Sat Jun 01 04:27:37 EDT 2019 | gregoryyork
Increase paste volume and use ramp soak spike profiling. Reducing volume of paste often leads to entrapment. Good idea to know difference between voiding and dewetting due to contamination
Electronics Forum | Tue May 26 12:25:34 EDT 1998 | Wayne
Vacuum Bakeout Ovens For many years vacuum bakeout ovens have been used in the hybrid industry for removal of moisture from ceramic cercuits prior to hermetically sealing packages. In this process the vacuum oven certainly reduces the bakeout cycle
Electronics Forum | Sat Feb 11 09:58:20 EST 2012 | cbeneat
I have a question for any Panasonic CM 402/602 users. We run Cree XPE/XPG/XPC LED's on our machines, and have struggled for years with the lights sticking in our nozzles. We have two types, I believe both designed by Cree, one picks the light up by
Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette
Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti
Electronics Forum | Fri May 13 19:48:28 EDT 2022 | cbeneat
Not completely. We end up increasing the blow off/vacuum break air pressure. The only issue with that is if we go too high, and a small part is close to the light it will blow it out of position. So on occasion there is a balancing act we have to do.
Electronics Forum | Wed May 16 16:34:09 EDT 2007 | aj
"Usually people use the vacuum to remove air and then replace with nitrogen to eliminate oxidation and a medium for bacterial growth. Why anyone would need to vacuum pack a pcb is beyond me, though. " We might get a batch of 400 pcbs in but the kit
Electronics Forum | Fri Dec 08 08:25:03 EST 2006 | jhaviland
Depending on the system you can program in a loop where if the board fails a contact to cycle the vacuum once or twice. it wears on the pins a little faster since you cycle 2 times (maybe more) per board but it could help increase the FPY. I know Gen
