Electronics Forum | Wed Apr 28 08:08:45 EDT 1999 | Dave F
| Can someone please supply me with a footprint for a SOT 426-L, or at least point in me the direction of where I could find one. | | Clint two sources for ya: 1 Check with your component supplier 2 Use the following link Good luck Dave F
Electronics Forum | Tue Apr 27 16:04:00 EDT 1999 | Frank Boyko
We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. Lately, we have been having solderability problems with boards with this surface from some of our suppliers. We are considering trying boards with White Tin solderable surfaces such D
Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach
| What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | Thanks, | | Frank | Frank, Refer to the device manufacturers. they are going to have a recomme
Electronics Forum | Tue Apr 27 07:20:34 EDT 1999 | Richard Marks
I'm a mechanical engineer and we buy electronic pressure sensors and switches. In doing quality audits, I need to understand what "best practice" will yield in terms of conforming product first time through the manufacturing process? Any data out t
Electronics Forum | Fri Apr 23 14:19:39 EDT 1999 | C.K.
Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these guys.
Electronics Forum | Fri Apr 23 11:31:35 EDT 1999 | J.J. Thomas
A customer told me that pad geometry was to be different depending on soldering process. I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should not e
Electronics Forum | Fri Apr 23 07:58:21 EDT 1999 | Vinesh Gandhi
We are an assembly house engaged in large volume manufacturing of Computer motherboards and others. We are in the process of selection of a new wave soldering machine. Can somebody help me inform what are the different parameters which must be ensur
Electronics Forum | Thu Apr 22 07:51:32 EDT 1999 | Vic Lau
after soldering transistors on a flex circuit (Ni/Au plated), one of the lead lift-up from the pad. under microscope (1,000 X), i find some cracks on the the pad surface. with edx analysis, the surface is mainly nickel. have you ever encounter suc
Electronics Forum | Wed Apr 21 16:38:19 EDT 1999 | Jeff Sanchez
I would like to protect my SMTNet e-mail account from others who use my system. I can't seem to find the pass word feature. Although I do incurage going to the site on my system I don't like the idea that everyone can go through my e-mail.
Electronics Forum | Thu Apr 22 09:28:22 EDT 1999 | Michael N.
Well Dave what are pads on the ceramic board is composed of is Paladium Silver but it is on the bottom, then comes the copper, then it is coated with tin, then it is coated again with nickel. What makes it even harder is that are devices are Gold lea
