Electronics Forum | Thu Feb 04 09:09:07 EST 1999 | dave
Can anyone help me with the pros and cons of trying to wave solder tantalum and large (1812) ceramic capacitors. I do know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what problems I c
Electronics Forum | Thu Feb 04 21:17:41 EST 1999 | Chris G.
| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | IPC states: 50% off pad for class 1 and 2 25% off
Electronics Forum | Fri Feb 05 17:56:38 EST 1999 | Chad Haim
| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. | | Thanks much, | | Earl Moon |
Electronics Forum | Thu Feb 04 20:31:10 EST 1999 | Dave F
| I'm researching SO-8 power RF device mounting methods. | | Possible mounting method | | 1. Via thru holes | | Still the thermal resistance of the PCB too high | | Do you have suggestions for mounting the component, PCB/? | Joni: What is it ab
Electronics Forum | Thu Feb 04 01:34:51 EST 1999 | Joe Cameron
Hello all, Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? We've checked our solder paste amount, and we've rechecked our reflow profiles and nothing has chan
Electronics Forum | Thu Feb 11 14:36:42 EST 1999 | Evelyn York
Hey, has anybody experienced problems with solder balls falling off BGA's? I have not been able to identify a contaminant nor any physical problems that would cause this. On packages with 'good' adhesion I have not observed any intermetallic form
Electronics Forum | Wed Feb 03 15:18:25 EST 1999 | Michael Allen
I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the part; th
Electronics Forum | Wed Feb 03 18:40:06 EST 1999 | Earl Moon
| Has anyone use this metal before? | | LOOKING for a process for using this metal. | Any feedback will help. | | Thanks | | Tony A | Yes. Cannot remember it all, but used in microelectronics industry. Germanium was used in diodes early on befor
Electronics Forum | Thu Feb 04 03:18:31 EST 1999 | Teemu M�kiniemi
There is also the process where thicker levels or solder is being applied directly to the board. This means no solder paste is applied before component placement. Just flux, place, and refow. Chris G. Can you tell me more about the process, or
Electronics Forum | Mon Feb 01 18:08:10 EST 1999 | Susan
Hello Everybody: I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. We are witnessing dull solder joints afte
