Electronics Forum | Sat Feb 19 05:34:45 EST 2000 | Dane Stokes
Also Jan, Don't you have to send your components through a filter program when transfering from a 4796 to a 4791 or vice versa. I know you have to do this when transfering a 4790 program to a 4791 because the speed data does not transfer correctly. I
Electronics Forum | Wed Feb 23 11:12:47 EST 2000 | TMV
This note is in response to your question about not being able to recognize a component that is running on a 4796 but has problems on a 4791. The 4791 and 4796 used two different recognition systems and the lighting calibration will be not be the s
Electronics Forum | Wed Feb 16 15:29:15 EST 2000 | John S.
My company manufactures electronic modules for the automotive industry. We have a current product that the customer would like a "heavy duty" version of. The module will have to handle roughly twice as much power as the original. A couple of compo
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Mon Jan 15 11:45:39 EST 2001 | bdoyle
Hi guys, thanks for the feedback! Wolfgang - we're looking into making this forum similar to the old one (displaying messages instead of just threads on the forum homepage). In the meantime have you checked out the feature "While You Were Out" whic
Electronics Forum | Tue Jan 16 09:23:26 EST 2001 | P.Gerits
Hello, Standard way to calculate stencil design can be done as follows: A normal ratio of aperture width/stencil thickness = 1.5 for pitches below 650u A normal ratio of stencil aperture width against pad width = 0.8-0.9 (or stencil aperture 10%-20
Electronics Forum | Tue Jan 16 14:53:24 EST 2001 | davef
Yanno what's interesting on that topic? A small number of voids make the solder connection of a BGA stronger than no voids. Moral of the story ... don't get too anal about voids. You should check the archives ;-) [har har har] we've discussed this
Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer
Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu
Electronics Forum | Tue Jan 16 21:27:56 EST 2001 | davef
No we do not use such a storage unit. We say our preferred environment is within: * 30%RH / 84�F * 30%RH / 72�F * 70%RH / 78�F * 70%RH / 68�F J-001C says [words to the effect of]: * At 30%RH and below you�d better make sure your ESD control program
Electronics Forum | Mon Jan 29 11:11:29 EST 2001 | Casey Scheu
The solder ball collapse is associated with overheating. Of coarse there's no problem taking it off, your nuking it. The problem, as your aware, is in the replacement. The machine your using is overdriving the process. The key to this repair is in
