Electronics Forum | Tue Jan 23 20:53:51 EST 2001 | davef
Sorry, not much help for me there. More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the boa
Electronics Forum | Tue Jan 23 10:57:54 EST 2001 | mdaley
Hello, I'm currently in the process of determining the best way to place bare die (flip chip) on our substrates. I've seen the Hover-Davis DDF and was impressed by it's capabilities. I particularly like the fact that I won't incur the cost of packa
Electronics Forum | Thu Feb 01 12:46:19 EST 2001 | cebukid
conveyor speed x dwell time = contact length and =====> inches / seconds x seconds = inches. First run your pump at a constant speed.....THEN,.... try running your glass plate at a very fast speed, and then you'll notice that your lengt
Electronics Forum | Mon Jan 29 11:14:44 EST 2001 | medernach
Hi all, Here's the deal. I have a customer for whom I assemble a lot of product. All of their product mix goes through a water soluble process. Much of it gets conformal coated. They are in the high power arena but some products are simply contro
Electronics Forum | Mon Jan 29 11:52:55 EST 2001 | blnorman
We have been using a VOC-free, no-clean flux on our boards that we conformally coat with no problems. We're using both a UV cured and a heat cured Silicone conformal coating. One thing to beware of is inhibition in the silicone. We found that out t
Electronics Forum | Tue Jan 30 01:32:24 EST 2001 | PeteC
Bill, We do solderpaste reflow on through-hole here every day on plated-thru-holes. We do it on connectors only. It is a reliable process. We use no special profile. The stencil apertures must be modified for this process. Check out the IPC-7525 "St
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Tue Jan 30 21:13:26 EST 2001 | davef
Two options: 1 Glue 2 Use a dedicated work holder with 'pockets' milled out to accommodate the components on the first side of the board after reflow. Some prefer a pallet that runs all the way through their process. So, these pallets: * Feature
Electronics Forum | Tue Jan 30 21:15:51 EST 2001 | davef
You seem to pretty far from shore to begin thinking about boats and floatation devices. Most laser trimmers are used by: * Semiconductor fabricators * Resistive component fabricators * Hybrid circuit assemblers Component fabricators and hybrid [
Electronics Forum | Tue Feb 13 07:26:26 EST 2001 | doctord
Bill, I can give you suggestions. First and foremost. Print a board and look under a microscope. Are you printing exactly on the pads? If you print on the mask, no matter how good we got the profile, no matter what paste we would get solder balls. Mo
