Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef
I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul
Electronics Forum | Mon Dec 14 10:53:10 EST 1998 | Earl Moon
| Has anyone had any experience with using this alternative plating process? Some board houses are pushing toward this plating. Is there any long term data on this process? Any problems experienced with smt and thru-hole? I've heard tin whiskers to b
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Thu Mar 22 13:06:50 EDT 2012 | smtmfgeng
Does anyone have any insight on alternatives to Indium NC-SMQ 92J solder paste for minimizing poor wetting on parts with oxidized leads (see datasheet here: http://www.dtsprocess.com/contents/articlefiles/6-SMQ92j.pdf). I am considering setting up a
Electronics Forum | Mon Jul 01 16:42:14 EDT 2013 | davef
I consider tin oxide on solder connections to be a process indicator. BR, davef
Electronics Forum | Thu Aug 24 13:21:57 EDT 2000 | Dave F
Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.
Electronics Forum | Thu Aug 24 13:18:24 EDT 2000 | Dave F
What are the primary indium (In) / tin (Sn) intermetallic compounds (IMC)? What are the drivers to the formation of In/Sn IMC? Copper / tin IMC are very bittle and, while necessary for proper solder connection formtion, are ment to be minimized. W
Electronics Forum | Thu Jul 17 10:56:50 EDT 2003 | James
COULD SOMEONE PLEASE TELL ME OF A WAY TO CLEAN THE OXIDIZATION OF OF WHITE TIN PADS, I AM GETTING ALOT OF DEWETTING PROBLEMS. AND I CONCLUDED THAT ALL THE BOARDS WITH WHITE TIN ARE HAVING THE SAME PROBLEMS. THANKS FOR THE INPUT.
Electronics Forum | Thu Jul 17 14:18:45 EDT 2003 | davef
What is this oxidation? What does it look like?
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