Electronics Forum | Fri Oct 18 13:13:38 EDT 2002 | Matt
What size are the spheres? you could have them laser re-balled with no induced heat.
Electronics Forum | Tue May 30 15:26:24 EDT 2006 | slthomas
I think we all know that the only gasification going on here is bovine excrement induced, but thanks for playing.
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Electronics Forum | Tue Jun 14 09:26:01 EDT 2011 | kenneth0
what is the clearance between the chips and the edges?
Electronics Forum | Tue Jun 14 10:02:11 EDT 2011 | travishemen
Thats .088" from component edge to pcb edge.
Electronics Forum | Tue Jun 14 17:21:46 EDT 2011 | isd_jwendell
I use a pizza cutter with parts closer than that, but they are small-ish (
Electronics Forum | Mon Jun 13 13:35:08 EDT 2011 | travishemen
Hello, does anyone have any information on stress induced during V-score depaneling. We are using a machine with a fixed blade on the bottom and a free rotating blade on top driven by a motor. We have had some cracked capacitors on the edge of an a
Electronics Forum | Mon Jul 12 13:06:32 EDT 1999 | Earl Moon
| I had parts replaced on SMT PWBs and the repair created measling defects. | Reliability Question: | Q1. Can measling be aggrevated or grow over time due to | temperature cycling and moisture. Customer environment is | -62C to +85C. | | Thank
Electronics Forum | Wed Oct 02 15:08:37 EDT 2002 | Eric
See Fiske first line. I'd bet You are bending or catching the assembly in the ICT. How many probes at 8OZ each? do you use on that ICT? 800 probes = 400lbs. See "Flexure induced failure of BGA solder joints" by Compaq Houston TX
Electronics Forum | Mon Oct 31 20:42:54 EST 2005 | davef
We don't think chip mount adhesives have very good sheer strength. If there's any flex induced during vibration, we doubt them to be a good choice.
.gif)
winsouce.jpg)