Electronics Forum | Thu Feb 16 12:07:19 EST 2006 | dpmilk
We have been using Coilcraft 1008CS inductors for several years. We have had problems with them turning green when we use lead-free solder paste. We have tried several solder pastes (water soluble and no-clean)from different manufacturers, but the
Electronics Forum | Mon Feb 20 09:20:07 EST 2006 | dpmilk
It appears to us that the problem lies in the lead-free solder paste rather than the inductors. We have not found a lead-free solder that does not do this. The green is on the copper wire. We believe it gets there during the reflow. The gasses fr
Electronics Forum | Thu Feb 16 16:16:19 EST 2006 | fredc
We saw something like this in the machine shop years ago. Fumes from a soldering operation in the shop turned exposed iron and steel tools and the spindle on my Bridgport mill green. Can your supplier apply plating or a coating to the exposed parts o
Electronics Forum | Mon Feb 20 07:59:50 EST 2006 | dpmilk
We saw something like this in the machine shop > years ago. Fumes from a soldering operation in > the shop turned exposed iron and steel tools and > the spindle on my Bridgport mill green. Can your > supplier apply plating or a coating to the >
Electronics Forum | Thu Nov 18 12:00:00 EST 2004 | Shean Dalton
Have you considered mounting this component after the assembly has been washed. Then, mounting the component and cleaning its solder joints individually. Alternatively, have you considered using alternative cleaning solutions to a saponifier (and a
Electronics Forum | Thu Jan 15 12:32:08 EST 2009 | vleasher
After doing some more research it looks like Loctite made a material called Cornerbond 3515 that seems as if it has the characteristics we are looking for such as curing after the solder is liquidous. But it appears that it isn't manufactured anymore
Electronics Forum | Fri Jan 16 16:36:37 EST 2009 | rwyman
We've used our standard chipbonder- Heraeus PD944- for this type of application. While it does cure before reflow, when the part is placed onto the site, the material compresses and spreads and thus that potential standoff isn't an issue. We've als
Electronics Forum | Sun Aug 10 03:41:20 EDT 2008 | eyalg
Thanks for your promt reply It was very usefull Eyal
Electronics Forum | Fri Aug 08 09:49:17 EDT 2008 | scottp
We've seen the exact same problem. The solder joints had negative wetting angles and x-sections show that the PdAg termination dissolved into the solder. We no longer allow PdAg terminations.
Electronics Forum | Sun Aug 10 03:39:21 EDT 2008 | eyalg
Thanks Pete yes we usu ROHS solder paste in our process. I agree that this termination is more suitable for adhsive bonding rather than soldering. We'll try changing the termination type as you recommended. Eyal G
