Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
Electronics Forum | Wed Jan 19 08:44:05 EST 2000 | Rob Douglass
I would like to hear any feedback (good or bad) about the OK Industries BGA-2000 Series BGA and Fine Pitch Rework System. I was not part of the selection process for this machine and my initial opinion is that this unit may be "under-powered". Loo
Electronics Forum | Mon Nov 29 14:35:03 EST 1999 | Mark D. Milward
We are in the process of researching and gathering information on establishing a zero-defect soldering program. I am sending for an IPC video on the subject. I am particularly interested in getting some direction and hearing from those of you in the
Electronics Forum | Mon Mar 23 16:20:10 EST 1998 | Robin Arnold
Do you know if there is an IPC standard or industry standard that addresses the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development Harris Semiconduc
Electronics Forum | Mon Mar 23 16:17:39 EST 1998 | Robin Arnold
Do you know if ther is an IPc standard or industry standard that addreese the issues regarding the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development
Electronics Forum | Thu Feb 12 17:25:15 EST 1998 | Chuck Griffith
What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch
Electronics Forum | Fri Feb 27 14:27:54 EST 1998 | David Spilker
| What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch
Electronics Forum | Fri Feb 13 12:56:23 EST 1998 | Scott Cook
| What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch
Electronics Forum | Thu Apr 04 09:22:35 EST 2002 | itempea
What are the normal control limits in the industry, for a well controlled process, using a 6 mils stencil? Should they be different according to the surface finish (higher UCL for ENIG, Im SN, etc, lower UCL for HASL)? Thanks, Ioan
Electronics Forum | Mon Aug 19 04:49:10 EDT 2002 | genglish
Can anyone lead me to information on capability studies for SMT Production, I know of several points during production to take relevant readings but is there an industry standard to adhere to and if so what? I have searched the archives to no avial.
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