Electronics Forum: industrial image processing (Page 17 of 84)

0201 Aperture design

Electronics Forum | Thu Oct 03 15:14:46 EDT 2002 | SMTGuy

Good Day Everyone, Can anyone offer any advice on 0201 aperture design? We are looking at an application that will require them. We would like to do some experimentation first. Also, assuming an OA flux, would we need a type 4 or 5 powder paste to p

HMLV AOI Implementation

Electronics Forum | Fri Jun 04 09:25:24 EDT 2004 | dana

We are presently in the process of selecting an AOI manufacturer for our facility. We are mainly HMLV (mixed technology). I've investigated several including MVP, VI, Yes Tech etc... They all give a good presentation, but I would like to get input fr

Double-Sided BGA Process

Electronics Forum | Tue Sep 14 13:54:13 EDT 2004 | paul_boxboro

I'm with Chris' approach as a first effort. If you don't have any luck, consider using a high (reflow)temp solder paste for the first pass reflow, and your standard solder paste for the second pass refow. Years ago I had a similiar challenge with an

Lead free component VS vision on Mydata MY12

Electronics Forum | Wed Nov 09 08:33:32 EST 2005 | gregp

Sounds like the vision is having trouble deciphering what is the component and what is the background. The problem is what if the plating is inconsistent (sounds like it is)? In this case with front (reflective) lighting the problem may never be so

Glue

Electronics Forum | Wed Sep 23 15:16:22 EDT 2009 | davef

Santiago can still maintain his current PTH, SMT, Reflow, Glue, Wave solder process flow and print glue with a stencil. In this, the bottom-side [contact-side] of the glue stencil requires cutting pockets that correspond with the clinched PTH leads.

Solder problem (bubbles?)

Electronics Forum | Fri Jul 08 15:19:56 EDT 2011 | markhoch

Your images are depicting signs of voiding. Some voiding is common. In an assembly like this, I would concentrate on minimizing the voiding as much as possible, and then using that as your baseline. I'd then treat the voiding as a process indicator.

Package On Package Problems

Electronics Forum | Wed Aug 22 02:50:59 EDT 2012 | robertwillis

Are you having any process problems with Package On Package Assembly? If so why not spend a few hours with the POP Team at SMTA International? You have a great opportunity to see, hear and experience POP in October. However if you really can't join

How important NSMD pads are for the QFN and similar packages?

Electronics Forum | Thu Jul 31 10:14:27 EDT 2014 | matusov

I know that some board houses have better > capability than others. Some can do down to 4mils > mask in between the leads I think. I know that it > also depends on the type of the mask they are > using - for some types you can't go down to the >

Juki KE-730 Comapred to Zevatech FS-730

Electronics Forum | Sat Aug 26 03:12:27 EDT 2017 | ausplex

Hi, We have a Juki KE-730, and was looking to buy a Zevatech KE-730 has a backup and for spares. We thought these machines would be identical, however when we looked at the circuit cards we noticed the image processing cards were quite different. I

AOI vs. XRay

Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy

Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm


industrial image processing searches for Companies, Equipment, Machines, Suppliers & Information

ISVI - Industrial Sensor Vision International Corporation
ISVI - Industrial Sensor Vision International Corporation

Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.

Manufacturer

3 Morse Road 2A
Oxford, CT USA

Phone: +1 203 592 8723