Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Thu Oct 03 15:14:46 EDT 2002 | SMTGuy
Good Day Everyone, Can anyone offer any advice on 0201 aperture design? We are looking at an application that will require them. We would like to do some experimentation first. Also, assuming an OA flux, would we need a type 4 or 5 powder paste to p
Electronics Forum | Fri Jun 04 09:25:24 EDT 2004 | dana
We are presently in the process of selecting an AOI manufacturer for our facility. We are mainly HMLV (mixed technology). I've investigated several including MVP, VI, Yes Tech etc... They all give a good presentation, but I would like to get input fr
Electronics Forum | Tue Sep 14 13:54:13 EDT 2004 | paul_boxboro
I'm with Chris' approach as a first effort. If you don't have any luck, consider using a high (reflow)temp solder paste for the first pass reflow, and your standard solder paste for the second pass refow. Years ago I had a similiar challenge with an
Electronics Forum | Wed Nov 09 08:33:32 EST 2005 | gregp
Sounds like the vision is having trouble deciphering what is the component and what is the background. The problem is what if the plating is inconsistent (sounds like it is)? In this case with front (reflective) lighting the problem may never be so
Electronics Forum | Wed Sep 23 15:16:22 EDT 2009 | davef
Santiago can still maintain his current PTH, SMT, Reflow, Glue, Wave solder process flow and print glue with a stencil. In this, the bottom-side [contact-side] of the glue stencil requires cutting pockets that correspond with the clinched PTH leads.
Electronics Forum | Fri Jul 08 15:19:56 EDT 2011 | markhoch
Your images are depicting signs of voiding. Some voiding is common. In an assembly like this, I would concentrate on minimizing the voiding as much as possible, and then using that as your baseline. I'd then treat the voiding as a process indicator.
Electronics Forum | Wed Aug 22 02:50:59 EDT 2012 | robertwillis
Are you having any process problems with Package On Package Assembly? If so why not spend a few hours with the POP Team at SMTA International? You have a great opportunity to see, hear and experience POP in October. However if you really can't join
Electronics Forum | Thu Jul 31 10:14:27 EDT 2014 | matusov
I know that some board houses have better > capability than others. Some can do down to 4mils > mask in between the leads I think. I know that it > also depends on the type of the mask they are > using - for some types you can't go down to the >
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