Electronics Forum | Tue May 13 17:53:54 EDT 2014 | anvil1021
Hello Michel...this might be a bit of a battle finding the low thermal EMF material that you are looking for. The first one that comes to my mind is Bismuth Selenium Telluride, with either a nickel or cobalt doping agent. Silver went away from this
Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite
Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process
Electronics Forum | Mon Feb 19 13:31:25 EST 2001 | billschreiber
Hello Mark, EPA Certification can be a tremendous help to the user that is evaluating new cleaning processes. Let�s face it, if it wasn�t for the Earth�s ozone layer, everyone would still be using CFCs and a vapor degreaser to clean stencils, PCBs
Electronics Forum | Fri May 18 13:30:52 EDT 2001 | mparker
I will start with the statement that I think it is great that we have the ability to solder SMT components that emulates wave soldered components. With that in mind, I would want to find acceptance criteria to be similiar, regardless of the solder me
Electronics Forum | Wed Jan 24 10:08:36 EST 2007 | electronhose
Immersion Silver, ImAg, is becoming the finish of preference. This is due to it having similar process limits vs. SnPb HASL. There were some early concerns about shelf life, but new chemistries have extended finish shelf life to 12 months+. Many boar
Electronics Forum | Mon Jul 20 12:39:11 EDT 2009 | bigdaddysoy9
Hello Reese, Lifted leads are and have always been a big concern for us. We were using a system that had 12 cameras total. 8 angled and 4 top-down. I could not get that to catch lifted leads without having a ton of false calls. I thought that may
Electronics Forum | Fri Jan 06 13:47:15 EST 2012 | davef
Your starting [and finishing] point should be IPC-7351B Land Pattern Calculator and Tools - http://landpatterns.ipc.org/default.asp For more, look here: * http://www.smtnet.com/bob-willis/pbdai.html * http://www.onboard-technology.com/pdf_novembre
Electronics Forum | Fri Sep 24 11:08:13 EDT 2004 | davef
We're not sure what you mean by temperature sensitive components. From an assembly process stand-point, every component we use is temperature sensitive to one level or another. More specifically, some of our products use polyphenylene sulfide (PPS)
Electronics Forum | Fri Sep 20 20:03:55 EDT 2002 | mjabure
Well chip I ought to leave you guys hanging in the breeze on this one , but here goes. Steve, your assumption that the nozzle is calculated as part of the component body for types 11 & 12 is incorrect. during center test on the 643's one of the par
Electronics Forum | Thu Oct 26 23:01:42 EDT 2006 | KEN
Larry, I've got to throw the BS flag here. "any part that could cause machine down time is kept in stock for immediate technical response." I have over 20 machines from Assembleon. I've been involved with many "firsts" throughout the evolution of
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