Electronics Forum: industrial image processing (Page 25 of 84)

lead free for multiple reflow process

Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam

We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l

Solderability using No-Clean Flux

Electronics Forum | Tue Jul 07 12:11:32 EDT 2009 | naynayno

We are in the process of transitioning from OA flux to No-Clean. Because of the tighter process window there is a lot of concern about component and PCB solderability and storage. The last thing we want to do is put some solderability specification

low thermal emf solder & paste - SAC 405

Electronics Forum | Tue May 13 17:53:54 EDT 2014 | anvil1021

Hello Michel...this might be a bit of a battle finding the low thermal EMF material that you are looking for. The first one that comes to my mind is Bismuth Selenium Telluride, with either a nickel or cobalt doping agent. Silver went away from this

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite

Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process

Solder paste high measurement

Electronics Forum | Tue Aug 03 13:46:46 EDT 2010 | davef

2 Benchtop paste inspection * Synapse 3D Master 3000neo Desktop SPI Machine [Synapse Imaging; Room#102-505, SK VENTIUM, 522, Dangjeong, Gunpo-si, Gyeonggi, South Korea; 82 3 1436 0430 http://www.synapseimaging.co.kr] * ZC1000 [PTS System (S) Pte Ltd

PIHR Inspection Criteria

Electronics Forum | Fri May 18 13:30:52 EDT 2001 | mparker

I will start with the statement that I think it is great that we have the ability to solder SMT components that emulates wave soldered components. With that in mind, I would want to find acceptance criteria to be similiar, regardless of the solder me

PbF PCB finish

Electronics Forum | Wed Jan 24 10:08:36 EST 2007 | electronhose

Immersion Silver, ImAg, is becoming the finish of preference. This is due to it having similar process limits vs. SnPb HASL. There were some early concerns about shelf life, but new chemistries have extended finish shelf life to 12 months+. Many boar

AOI side angle cameras

Electronics Forum | Mon Jul 20 12:39:11 EDT 2009 | bigdaddysoy9

Hello Reese, Lifted leads are and have always been a big concern for us. We were using a system that had 12 cameras total. 8 angled and 4 top-down. I could not get that to catch lifted leads without having a ton of false calls. I thought that may

0201 pad layout

Electronics Forum | Fri Jan 06 13:47:15 EST 2012 | davef

Your starting [and finishing] point should be IPC-7351B Land Pattern Calculator and Tools - http://landpatterns.ipc.org/default.asp For more, look here: * http://www.smtnet.com/bob-willis/pbdai.html * http://www.onboard-technology.com/pdf_novembre

About temperature sensitive component

Electronics Forum | Fri Sep 24 11:08:13 EDT 2004 | davef

We're not sure what you mean by temperature sensitive components. From an assembly process stand-point, every component we use is temperature sensitive to one level or another. More specifically, some of our products use polyphenylene sulfide (PPS)


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