Electronics Forum | Thu Apr 30 16:13:38 EDT 1998 | Chrys
| | | | | Hello - | | | I am interested in obtaining information on the possibility of integrating a Vision Inspection System with an SMT line. I am aware of systems which may be used to gather placement data and such, but are there any systems whic
Electronics Forum | Sat Apr 25 12:58:13 EDT 1998 | Earl Moon
| Is there an industry standard in calculating SMT process | PPM level for benchmarking purpose ? What are the industry | benchmark ppm number for some of the defects like solder | short for 20-mil QFP, tomstone problem for 0603 components etc....
Electronics Forum | Mon May 06 02:30:25 EDT 2002 | dszeto
We have continual vision process error 1CB02003 on narrow view camera during nozzle centering measurement. The wide view camera works properly. So far we have done the following things to rectify the problem but the problem still exists: 1. Replac
Electronics Forum | Mon Apr 02 09:16:08 EDT 2007 | ed_faranda
Was wondering if anyone had any experience with Pin Though Paste with a no-lead process? I realize that some basic requirements will need to be met (i.e. Connector to with stand higher temperature, proper lead coating, ability to image, etc.). But,
Electronics Forum | Mon Apr 03 04:31:32 EDT 2000 | Jacqueline Coia
Hi there, Just looking for a little informative feedback on an AOI proposal. Along with the test department we are about to embark on a feasibility study on using National Instruments' 'Labview image aquisition'(h/ware + s/ware) as an alternative to
Electronics Forum | Thu May 03 10:38:42 EDT 2001 | davef
You need to have a way to qualify and monotor your process. X-ray and ERSA's fiber optic inspection thingies are two approaches for doing that. There are lots of good x-ray machines out there. Get a transmissive x-ray machine with resolution of 10
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Mon Jun 18 19:22:38 EDT 2001 | Gil Zweig
Dave; See my answer to "Alternate to X-ray" The combination of endoscope optical inspection with x-ray inspection provides the most effective means of BGA inspection. Transmission x-ray provides a very rapid means of qualifying then process control o
Electronics Forum | Wed Jul 22 12:34:43 EDT 1998 | Frank Silva
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai Stoney, Check out Nicolet Imagi
Electronics Forum | Mon Jul 01 16:15:02 EDT 2002 | Matt Kehoe
We are currently trying to gather information pertaining to applying LPI soldermask thicker than normal. The thick coating is necessary for the SIPAD ssd process however, because of the numerous brands of mask and application methods there is no sing
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