Electronics Forum | Mon Dec 27 18:44:14 EST 2004 | Mark
I am testing some BGA's (PBGA 30mm x 30mm) to evaluate the maximum ramp rate we can achieve in our reflow oven. Temperature is being measured at the body(top) of the component / not leads. After several trials (with various oven settings), the high
Electronics Forum | Tue Jan 18 12:44:24 EST 2000 | Russ
I have found that reducing the amount of metal in the joint makes a difference, we have reduced the aperture sizes to provide a minimal amount of paste. just enough to hold the part during handling. You may also want to try and slow the initial ram
Electronics Forum | Tue Aug 17 13:36:17 EDT 2010 | hegemon
Since you have home plated the apts and done solder reduction, I would take a look at your soldering profile. We have run into this before when running no-clean and found that reducing the initial ramp rate to the flux activation was a help in the
Electronics Forum | Fri Jul 04 00:36:25 EDT 2008 | shrek
Try a linear, very flat ramp rate on the order of 0.5 degrees celcius per second. I know this is hard to accomplish with a five zone, but try to lower the first couple of zones (the preheat zone), and then spike to reflow aggressively during your la
Electronics Forum | Mon May 09 16:44:33 EDT 2011 | dcell_1t
Hi, We have been struggling with an issue of non wetting on a QFP (Renesas - 256, Sn90Pb10) but the issue "desapears" sometimes for a while and then back again suddenly. This is the scenario: Component: QFP 256 / Renesas / Sn90Pb10 / 0.5 mm pitch S
Electronics Forum | Mon Dec 23 13:18:04 EST 2013 | stustu
I'm fairly new to SMT, but highly experienced in other materials engineering areas. But have found the definitions/specifications for pastes to be both confusing and inadequate. I have often see graphical representations of the "desired" thermal pro
Electronics Forum | Fri May 29 16:07:55 EDT 1998 | Steve Gregory
| | Thanks Steve- | Here is the whole story: | | The solder balls are appearing all over, similar to a | splatter. They are relatively small. We are using H-Technologies | S-HQ no-clean solder paste. The stencil is 6 mil and the boards | are ru
Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon
| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the
Electronics Forum | Mon Jun 01 14:35:59 EDT 1998 | Rich
| | | | | | Thanks Steve- | | | Here is the whole story: | | | | | | The solder balls are appearing all over, similar to a | | | splatter. They are relatively small. We are using H-Technologies | | | S-HQ no-clean solder paste. The stencil is
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
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