Electronics Forum | Fri Sep 04 02:27:48 EDT 2009 | hurr
Hallo all, when I remove one from us malfunction BGAs from PCB I saw under X-ray inspection inner hairline crack.(see fig.1.) BGA was dried according to J-STD 033 and reflowed in lead process. When I look at new (baked BGA) under X-Ray inspection I
Electronics Forum | Wed Sep 09 11:17:09 EDT 2009 | clampron
Hello Radek, Does a new (unbaked) BGA exhibit the same crack? If so, adress this with the manufacturer. If not, what are your baking parameters? Chris
Electronics Forum | calum23 |
Fri Feb 12 02:55:13 EST 2021
Electronics Forum | Tue Mar 10 04:37:44 EDT 2020 | luciano_zhang
I have a files need produce in a urgent time. It's 4 layers PCB with 3 OZ inner and out layer quantity need 10000pcs ,any one know which supplier is aviliable?
Electronics Forum | Thu Mar 12 08:38:47 EDT 2020 | floravictor
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Electronics Forum | Fri Jun 12 09:10:48 EDT 2020 | apcpcba
Hello, we can meet your request, welcome to visit our website: https://www.apc-pcbassembly.com/
Electronics Forum | Thu Jun 11 09:28:57 EDT 2020 | pcbkathay
Dear Luciano, We are PCB manufactured based in China,we can produce the PCB as your requirements as soon as we can, please send the files to my email 284816044@qq.com looking foward to your email.
Electronics Forum | Thu Jun 11 02:32:54 EDT 2020 | beanzheng0
Hi, Luciano This is James from http://www.nextpcb.com We can do your order we have 2 manufacturers over 2500000sq. The 4 layer PCB boards on sale now. Please send your inquiry to support@nextpcb.com Or you can contact me on WhatsApp:+8613243830029 S
Electronics Forum | Thu Nov 17 20:23:55 EST 2005 | davef
We're with your customer. We believe inner layer separation is not linked to a heating excursion. What you are seeing is separation between the hole wall and the copper plating in the barrel of the hole on an unstressed PTH. Although, it's possibl
Electronics Forum | Tue Jun 05 06:37:48 EDT 2012 | mosborne1
Definition: Pink Ring - A condition that can exist in multilayer printed circuit or wiring boards, in which the oxide around a through-hole inner layer interface is chemically removed, and there is a lack of adhesion of the inner layer to the dielec
