Electronics Forum | Mon May 30 09:37:26 EDT 2022 | dimamalin
VERSAPRINT S1 ,ERSA PRINTER with built in AOI system, good-looking on paper.
Electronics Forum | Mon May 30 15:55:28 EDT 2022 | spoiltforchoice
~Except that would appear to be a language things, it says AOI, it means SPI. Presumably very much 2D not 2.5 or pseudo 3D too (not that such is relevant)
Electronics Forum | Tue May 31 08:16:25 EDT 2022 | dimamalin
https://smtnet.com/company/index.cfm?fuseaction=view_company&company_id=48480&component=catalog&catalog_id=16771
Electronics Forum | Wed Jun 01 13:29:34 EDT 2022 | emeto
It is almost like attempt to advertise something or dig into market opinion for future development of something. In both cases looks like scheme - not clear what they ask for, not clear what they want to achieve.
Electronics Forum | Thu May 26 07:53:42 EDT 2022 | jojoled
Hi.Thanks for reply. 1. - I guess after JETting the paste, the head will go aside, to allow head with HD camera(SPI) to do the job.....and thus if used for AOI , the same camera will be much higher above components, not damaging anything....this is
Electronics Forum | Wed May 25 23:45:04 EDT 2022 | SMTA-64387687
1. The jetting head flies very low to the level of the board. So, performing AOI function will crash the head. 2. AOI is performed close to the end of the line, after P&P or reflow. Are you planning to run the boards back-and-forth, on the line? 3. L
Electronics Forum | Wed May 25 19:25:24 EDT 2022 | jojoled
Thanks "Spoiltforchoice" for Informations, I have found allready a Chinese company which has such machines, just wanted to check other options from other countries too. I know it is from other end of linear process, but from my point of view (plus wh
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
Electronics Forum | Fri Feb 19 14:43:46 EST 1999 | Nithy
We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not be
Electronics Forum | Fri Jan 28 01:56:32 EST 2005 | Chua
Hi, I could like to find out what are the things need to look out if I'm doing a new SMT solder paste ( water soluble & no-clean ) evaluation. And also flux ( spray type ) for wave-solder ( water soluble & no-clean ). Appreciate for all the input..
