Electronics Forum | Thu May 09 00:08:01 EDT 2002 | techment
Could someone provide help regarding IPC's recommendation on Plated Through hole's --- lead to hole ratio. I can't find it in IPC-2221 and IPC-SM-782. Thank you very much
Electronics Forum | Thu May 09 17:24:11 EDT 2002 | davef
First, SM-782 elates to surface mount pads. So, expecting to find PTH design rules there is a bit of a stretch. Search the fine SMTnet Archives for similar threads. For instance here�s one from last week: http://www.smtnet.com//forums/index.cfm?fu
Electronics Forum | Thu Jan 06 08:03:47 EST 2005 | davef
On solder in vias: It looks like the via are not solder masked well and pick-up solder either: * Solder coating ... OR * During leveling It's possible that the design specifies openings in the solder mask for these via. On solder in the unsupporte
Electronics Forum | Tue Jul 06 18:16:14 EDT 1999 | Boca
| | Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area.
Electronics Forum | Tue Jul 06 17:03:46 EDT 1999 | Earl Moon
| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th
Electronics Forum | Fri Apr 21 12:43:51 EDT 2000 | David
We are going to hand place through hole connectors by screening them top side in a double sided reflow board. I saw this done before sucessfully on a daily basis but is there anyone with a paper or specs as to what aperture size, any special pad cons
Electronics Forum | Thu Oct 03 04:04:10 EDT 2002 | Bob Willis
SMTNet has a video tape and interactive CD ROM on Intrusive Reflow Soldering that you may want to check out. In addition there are some free inspection standards for pin in hole printing, placement and soldering available at http://www.dpmo-monitori
Electronics Forum | Thu Nov 20 15:21:54 EST 2014 | warwolf
We process an average of 300 units per batch with spikes to 750, we can sustain about two to three people populating to maintain good quality/throughput. Part placement is broken up equally to reduce operator stress(usually a limit of 5 different pa
Electronics Forum | Thu Aug 21 17:17:47 EDT 2003 | justin
Do some push / pull testing. Typically with black pad, you can flick the components right off the board. If you have this, the boards are about as reliable as a Yugo. If you get decent push / pull results, odds are you don't have black pad and you
Electronics Forum | Wed Feb 05 19:43:34 EST 2003 | iman
If by the Powers Ta Be (customer/designer), you can't change the PCB design, negotiate for the PCB fab house, to block the via holes with their (green?) solder mask some customers/designers want to have via holes to be present in the PCB pad, due to
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