Electronics Forum | Tue Jun 05 14:38:55 EDT 2001 | pteerink
You would be better served to check your print quality as you run. Any problems caused by dirty stencils ( plugged aps etc ) would show up right away as a defect. Search the forum for more on this subject. I seem to recall the same subject coming up
Electronics Forum | Wed Dec 14 12:57:23 EST 2005 | grantp
Hi, Wow, that's cheap. I did not know they were available that low cost, and we had been quoted much higher for the Ursa scope, so that's why I thought why bother, and lets put it into xray. I bet Superman would have a terrible time working in an S
Electronics Forum | Fri Oct 30 08:12:10 EDT 2009 | rajeshwara
HI NEMO , I HAVE GOOD EXPERIENCE OF PDT AOI SUPPLIED BY SAMSUNG TECHWIN IT IS CAPABLE OF HANDLE SUCH THING AT GREAT LEVEL ,JUST NEED GOOD UNDERSTANDING OF PROGRAMMING AND DEBUGGING , WE ACHIEVED 100 PPM WITH HELP OF IT , U GO FOR 5 CAMERA WHICH WIL
Electronics Forum | Sun Nov 08 10:22:52 EST 2009 | doremi
Hi everybody, First of all, to have process under 100% control you should have AOI after every active process in the pcb assembly line : - Post printing (2D or 3D Solder paste inspection machine); - Post reflow; - Post selective(wave solder). It i
Electronics Forum | Thu Nov 19 14:38:49 EST 2009 | doremi
Oh, my dear, printer is just a part of the full picture. Without good and stable pick and place what if the printer is excellent???It is all important - printer, solder paste,stencil,P&P,oven,AOI and of course good process engineers or whatsoever are
Electronics Forum | Thu Apr 27 21:20:38 EDT 2000 | Dean
Here are some pointers to use during your X-ray inspection. Microcracking is virtually impossible to determine with X-ray. However, I suspect you are looking for "hard" opens. Those are much easier to find visually. If using a paste-and-place pro
Electronics Forum | Tue Aug 18 20:57:15 EDT 2020 | dwl
Specs like beam voltage, current and focal point size are important considerations for image quality and you can spend hours going down the rabbit hole learning about them. Fundamentally, what really matters is if you can get an image clear enough to
Electronics Forum | Thu Jun 12 03:41:47 EDT 2003 | sanjeevc
Most of the tools that are available in the market eg.ERSAscope or something similar gives a fair idea about the outside rows only and in case the defect happens in the inner layers all these tools are useless.The best way is to use AXI but then its
Electronics Forum | Fri Jun 20 18:12:42 EDT 2003 | blundell
This is a very narrow view you have, X-Ray does not see all the problems that can occur, even with good rework gear or a sound reflow process it is still possible to get soldering defects, how do you know if you have a sound process to begin with if
Electronics Forum | Wed Jul 05 00:57:17 EDT 2000 | Roni Haviv
Hello, I need some information about the DPM of escape defects that were detected in ICT -not including defects that were detected in visual inspection sooner. I'll appreciate any kind of information, Thanks Roni
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