Electronics Forum | Fri Nov 22 11:31:52 EST 2013 | igorfo
Hi I aa QE on SMT line that produce products for Home introduction. No so long ago we have a problem with soldering of BGA Head on Pillow (root cause mismatching customer requirements and BGA profile spec, suplier change %Ag) and our product affect
Electronics Forum | Fri Nov 22 16:55:30 EST 2013 | hegemon
Head and Pillow defects beneath a BGA are difficult to find, no matter what the equipment is on hand. Since you do not appear to have access to tools that would help you, or $$ to purchase said tools, I might recommend that you use an outside source
Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc
About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very
Electronics Forum | Tue Apr 09 15:23:05 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Tue Apr 09 15:24:10 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Tue Apr 09 15:24:29 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Tue Feb 09 13:47:46 EST 2010 | davef
BGA rework equipment: Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=48736 Use x-ray inspection to identify the obvious defects such as shorts, missing balls and gross solder voids.
Electronics Forum | Tue Apr 09 21:40:26 EDT 2002 | ianchan
We are a local enterprise with limited resources, just like you described, so hope this experience sharing helps : we place a production Visual Mechanical Inspection (VMI) inspector at the end of each Reflow Oven area, complete with magnify scope 30
Electronics Forum | Fri Apr 02 10:26:13 EDT 2010 | fishingfool
Manjunath The top camera will be used for probably 90-95% of your inspection needs. However, without side cameras that 5-10% of uninspected parts can be a real pain to manually verify. What you need to figure out is what is your product to inspe
Electronics Forum | Fri Apr 12 15:48:33 EDT 2002 | jersbo
SPC for each assembly(I use C(for board defects)NP(for unit defects) at the end of reflow to determine process capabilities determine Control limits. Once control limits are set, inspectors stop the process until out of control limit is addressed and
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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