Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar
Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha
Electronics Forum | Mon Jul 05 02:32:14 EDT 1999 | Vinesh Gandhi
Dear All, We are a medium sized Electronic manufacturing company manufacturing computer motherboards and Telecommunication products. We have a big debate going on within our company regarding the defect rate measurement technique. At present we
Electronics Forum | Fri Dec 03 12:01:14 EST 2004 | mruzicka
AOI (automatic optical inspection) is not capable to detect hidden joints (BGA, J-leads,...) defects. For that you will need X-Ray (AXI = Automated X-ray Inspection). Look @ http://www.agilent.com, they have both systems. It is usual that PWB manufac
Electronics Forum | Tue Feb 07 09:49:10 EST 2006 | George
Hello everybody, I have been asked to establish a way to improve our wave solder process. I wonder where I should start. We collect data by inspecting our PCB's visually. What's the best way to report data? Ocurrence of defects in total among all
Electronics Forum | Wed Oct 09 13:05:34 EDT 2019 | dwl
In my experience 100% visual inspection of a first article is good but visual inspection of production boards is not really useful, if you have AOI and ICT. If your process is good and defects are uncommon, human inspectors go on autopilot and miss m
Electronics Forum | Fri Jul 15 10:56:19 EDT 2005 | pr
As Russ said, you do a DOE beforehand. BUT Maybe we are missing something, we do SPC after the wave (1/5) to catch defect trends and fix them with a minimum of inspection. If you are running a 2,000 piece pull, are you that confident that your origin
Electronics Forum | Mon Jun 18 19:32:58 EDT 2001 | Gil Zweig
I believe that at the present time the industry really does not know how to use x-ray inspection apart from indentifying the obvious defects such as shorts, missing balls and gross solder voids. The real utility of x-ray inspection is to recognize: 1
Electronics Forum | Wed Jun 13 08:25:44 EDT 2001 | ghenning
Is anyone aware of benchmarking data to suggest what is best-in-class (and average) performance for manual visual inspection? We would like to better understand what percentage of defects going into the process will be screened out. This provides us
Electronics Forum | Wed Oct 16 12:51:46 EDT 2013 | deanm
Why isn't the data that is collected being used? Either use the data or stop taking it. Without AOI to improve your process you need to do this: 1. Collect data on all defects found by your inspection department and have it in a form such as a sprea
Electronics Forum | Mon Jul 07 00:33:12 EDT 2003 | praveen
First we have to look in to the current situiation of the SMT line.Is the pick and place machine very old and can not perform consistently. Is the board to be inspected is very dense and have lots of connectors and fine pitch comp.with lots of 0402 c
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