Electronics Forum | Thu May 14 22:45:46 EDT 2009 | davef
You're correct. It's a peculiar looking defect. With measling, we expect to see discrete white spots or crosses just below the surface of the base material. We don't see that here. We do see a similar condition at almost every PTH in the picture, a
Electronics Forum | Fri Jun 25 08:55:47 EDT 2004 | Vincent
Hi, I am tasked to implement process change in our mfg floor. And one of the big problem that I can see is that to change a company culture where QC dictates the process and inspects every PCB. From what I know QC conducts random Inspection and oper
Electronics Forum | Tue Oct 17 18:10:05 EDT 2000 | Philip A. Reyes
Yes, you need to conduct X-ray inspection for BGA-SMT assembly, but it doesn't mean 100%. If your process is well capable and robust you can do sampling. There is an available X-ray machine that right now Iam assessing, cause we are going to buy one.
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
Electronics Forum | Thu Feb 14 20:24:07 EST 2002 | scott
My first reaction would be to run! FAST! Flex -- well, it... flexes... and isn't flat. While you assemble it, While you transport it, While it goes through the oven... SMT Connectors typically need to be held down during reflow. Fiducial types are
Electronics Forum | Tue May 10 09:54:35 EDT 2016 | reinhardk
Hi all, kindly asking for some hint with a problem we encounter with our SPI: After inspection, the SPI should show the defect details, but it doesn't. I can see the files created by the realtime-card in the exchange-directory between windows- and
Electronics Forum | Tue Mar 02 02:46:36 EST 2021 | Jessie Gao
If there is a way to ensure that the product is reliable, it is to ensure the predictability of its PCB, which is an important part of the product. In fact, PCB is the core component in almost all electronic products (from phones to computer systems)
Electronics Forum | Mon Apr 17 18:29:03 EDT 2006 | lit
There is learning on all brands requiring fine tuning the test parameters. The first point is not to allow defects to escape. Many brands can do a good job with preventing escapes. The struggle with all the brands becomes false calls. The companies r
Electronics Forum | Wed Sep 29 16:04:29 EDT 2010 | hegemon
In my experience, the best way to do a lifted lead inspection on a QFP is by laser height measurement. It is very difficult to consistently catch a lifted lead with only a top down camera. As you say, too many false calls, and still some escapes.
Electronics Forum | Thu Jul 18 09:55:05 EDT 2002 | gdstanton
Mike, When we measure solder inspection yield by dividing the number of defective joints on a CCA by the total number of joints on the PWB. A defective joint is classified only once. That is we don't count multiple defects on the same joint. Our
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
