Electronics Forum: instruments 200g 210 (Page 1 of 1)

Re: PCB Warping.

Electronics Forum | Mon Mar 16 18:15:32 EST 1998 | ETS, LLC

Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago that deals with this exact subject. Best way to deal with this is to use a center

No Lead BGA Hot Gas Rework

Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken

I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o

Re: PCB Warping.

Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon

| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce

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