Electronics Forum | Sat May 20 22:09:43 EDT 2006 | Ola
Interesting... We had visitors from (maybe out of space) that claims that the fumes!!! from whithin the reflow leadead solder process in an oven can get caught inside the oven during time and later on when we fire up the beast to the lead free temp-p
Electronics Forum | Wed May 17 23:45:05 EDT 2006 | smt_guru
The question to ask is not so much in contamination of this mixed technology metallurgies, but rather, will this metallurgy successfully coalesce into a reliable interconnect? I find in my consulting travels worldwide that many of my clients do not
Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
Electronics Forum | Thu Nov 19 10:24:14 EST 1998 | Brian Co nner
Currently, I am having problems with a AMP Mictor connector at the wave process. These connectors have both SMT leads(topside) and thru-hole leads. Even though we have re-designed the board for via issues. We still see some of the SMT leads re-fl
Electronics Forum | Mon Feb 05 20:43:27 EST 2001 | davef
1 Solder on gold fingers comes from: 1a About 70 % of the time it's caused by poor cleaning of screen printer, staging area (table), conveyor, reflow oven chain or belt, and keeping boards separate from cleaning process 1b After loading paste onto
Electronics Forum | Mon Jul 26 19:37:47 EDT 2004 | Grant
Hi, It was funny. The sight of 3 men standing around the microwave daring each other to push the start button, and then freaking out when the whole thing looked as though it was going to explode was funny. I guess you have to try these things! Tho
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Thu Jun 17 10:25:43 EDT 1999 | Brian Wycoff
| | We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centr
