Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval
Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu
Electronics Forum | Wed Jan 15 21:55:41 EST 2014 | padawanlinuxero
we do that and there's a variation on the solder temp. sometimes around 10 degrees, we have 2 solder pallets that are run in intervals of roughly 3 1/2 minutes a part (the time that take the operator to put all 3 terminals in a 42 pcbs per board, and
Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms
Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid
Electronics Forum | Sat Oct 12 05:40:05 EDT 2002 | Kenture
Hello All, I am having issued with insufficient solder due to via in pad. It is a 10 mils via and PCB is 70 mil thick. Six mils stencils was used since there are some 20 mils (No clean process). Any recommendation? Thank you.
Electronics Forum | Thu Jun 25 11:11:13 EDT 2009 | bruna
Hello, I want to hear some experience about selective soldering for PCB using nozzle plate and screens Do you have solder defects? bridges and insufficient soldering? How do you combat that? and about the screens you have good quality? What is the f
Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Mon Sep 12 05:43:53 EDT 2011 | aungthura
Hi All We have run the Hast Burn-in-Board into 2 soldering Process,first-Reflow and second-Wave. After wave soldering, there are many insufficient solder in the via holes.The via holes are wide as 15mil. Then, as customer's request, we have to cover
Electronics Forum | Tue Sep 25 12:50:13 EDT 2001 | mparker
Since you are mostly concerned about the flux and suspect an application issue, you need to do a few things to validate whats going on. 1. Forget about speed of processing, length of time to do the job. Focus on accuracy first, then speed. with that
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
