Electronics Forum | Tue Jan 13 07:44:48 EST 2004 | Chris Cottreau
Upon inspection were seeing most if not all of these SOT 23 are not reflowed properly. The components just sit on top of the solder, this is creating insufficients, poor wetting, etc. There are about 25 SOTS per board, 2 boards per panel creating alo
Electronics Forum | Tue Jan 13 10:25:29 EST 2004 | James
Do you have a different reel of parts. The leads could be oxidized from age. If everything else is soldering well, I would try that. Is your profile on your oven correct?
Electronics Forum | Thu Feb 27 13:59:52 EST 2014 | rway
I agree with Comatose; although, 30 seconds I feel is stretching it bit. I would say anywhere from 40-60 sec. 5 seconds for removal 15 seconds to install (tack) 10 seconds to solder 10 seconds for inspection There's no need to dress the pads. Use t
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Tue May 25 07:03:34 EDT 1999 | Milan Z.
After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) Where is the problem? Thanks in advance!
Electronics Forum | Mon Sep 23 22:31:48 EDT 2002 | davef
Comments are: * It�s interesting, but not surprising that your time above liquidous varies around the sides of this component. * You are correct in thinking that it is better to reduce than to increase the temperature differences around the component
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
