Electronics Forum | Sat Dec 15 06:34:54 EST 2012 | sowmya
Normally paste manufacturer specifies stencil life of a paste is 10 hours. the question is, if i run a continuous manufacturing for 40 hours, we will be adding 250 g of paste for every two hours. The addition of 250 g will be mixed with the paste whi
Electronics Forum | Mon Dec 17 09:38:27 EST 2012 | cyber_wolf
Why scrap paste if there is no degradation of performance? Do your own study to determine this.
Electronics Forum | Mon Dec 17 08:34:58 EST 2012 | emeto
I would scrap it. As you said part of it is going to be old paste. All manufacturers don't recommend mixing old with new paste because you change the rheology of the paste.
Electronics Forum | Mon May 30 06:36:16 EDT 2011 | mbnetto
This is a requested point from some customers. It's part of the audit check points. But I agree it´s important for the process. You can garantee the stencil is in a good condition after many time using it. If your stencil looses the tension, you can
Electronics Forum | Tue Jul 19 14:33:17 EDT 2011 | ccouture
Has anyone tried using a product thet when applied to a stencil, it facilitates the release of solder paste from the stencil, including the fine pitch openings. It makes the stencil's surface "fluxophobic". Same principle as Rain-X for windshield. A
Electronics Forum | Wed Jul 20 05:49:45 EDT 2011 | kenneth0
I think you are referring to nano coatings. Try google nano coated stencils
Electronics Forum | Wed Jul 20 13:02:48 EDT 2011 | markhoch
I just asked the same question a few weeks ago. Here's the link to that thread: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=15684&mc=3
Electronics Forum | Tue Jan 26 16:29:48 EST 2021 | charliedci
We will be exploring the exciting world of step stencils for the first time and I am looking for any advice from anyone using regularly. This direction is because we have large caps and soldered standoffs along with medium pitch LGA's and QFP's on sa
Electronics Forum | Fri Oct 21 14:13:08 EDT 2005 | mafc65
1.- Clean bottom and top stencil with a cloth/alcohol at same time.Pay special attention to fine pitch locations. 2.- Clean again bottom stencil side .To prevent any residual of solder 3.- Blow air with a air gun under the stencil to remove the solde
Electronics Forum | Fri Feb 05 02:40:40 EST 2021 | victorzubashev
For components with the large pads, you can also use secondary soldering dispensing. Some printers like DEK have an option to mount a syringe with an auger valve to do dispensing after the printing step process. Obviously will not work if you have to
