Electronics Forum | Tue Aug 31 20:51:20 EDT 1999 | Raeto Zryd
Dear fellow process engineers, Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints were
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
Electronics Forum | Thu Mar 18 18:40:15 EST 1999 | Marc Ruggiero
| | | Hi folks, | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volum
Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram
Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo
Electronics Forum | Wed Feb 14 02:06:05 EST 2018 | ameenullakhan
Hi Evitmov, Thanks for your valuable suggestion. we have used RTS profile. And profiles with an average soak and reflow time.:( Those profile didn't help us so much. It at later stage we have adopted to this hot soak profile. There is one partic
Electronics Forum | Thu Jan 27 21:28:36 EST 2000 | G Henning
strong interface to CAD for programming a must. Integrate with MRP systems, online (web based) component parameter data? No CAD data? Why not scan the blank with the P&P and recognize footprints/ designators. Diagnostic messages must be concise and a
Electronics Forum | Tue Jan 25 17:47:01 EST 2000 | Dennis VanBuren
We are integrating an "Additive Process" on one of our boards - incorporating numerous mod wires, cuts, and new component placements. Some of the new runs pass next to fine pitch devices and will require stencil modifications to accommodate the Addit
Electronics Forum | Tue Aug 20 07:35:04 EDT 2002 | bmulcahy
Hi, I guess you a looking for a manual x-y table with a vacuum pick up such as SMT6000 from OK industries. I presume these are still being made-- We use one successfully at the end of a Mydata machine to place low volume components which we cannot j
Electronics Forum | Wed Sep 11 06:48:19 EDT 2002 | gerits
Dear Sir, We as Assembl�on (member of the Royal Philips group, former Philips EMT) have several solutions for you or we can give you support with your request. Either on how to handle the components manually or automated. Feel free to contact me or
Electronics Forum | Fri May 07 12:02:28 EDT 2004 | Dreamsniper
From my understanding paste on BGA pads are applied only to help in holding the component as the PCB is conveyed during the manufacturing process then soldered. But during rework on BGA's do I have to apply Solder Paste or just Flux? What's the diffe
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