Electronics Forum | Mon Mar 01 09:49:04 EST 1999 | Justin Medernach
| It seems to be that we have to much NaCl left on our assambled PCB's. | The flux we use is from cobar. They say it can not be from the flux... So what can be the reason, what kind of problem may occer when there is to much NaCl. | George, Are you
Electronics Forum | Tue Jan 05 18:18:56 EST 1999 | Hallj
| If passive componets are cheaper why aren't they more popular? Manufacturers like Murata and AVX claim availability and substantial cost savings but little interest seems to exist. Why? Your input is greatly appreciated. | I use bulk fed compon
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Fri Sep 08 06:45:33 EDT 2000 | Lu�
For investigation purposes I need to find urgently this integrated circuit(#2): RS 305-800. I do not know who is the manufacturer of this zero voltage switch. The RS components said to me that this switch is discontinued now. I have an scientific pro
Electronics Forum | Mon Sep 28 19:07:47 EDT 1998 | Steve Gregory
| I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it poss
Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
Electronics Forum | Tue Dec 07 14:23:34 EST 1999 | JAX
Vahid, What type of error are you talking about? If you mean accuracy I would stick to round fiducials. As far as machines, the only question is about active component placement. For passive components Fuji(CP-series) is the way to go. O
Electronics Forum | Mon Mar 15 10:08:25 EST 1999 | Justin Medernach
| Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probably
Electronics Forum | Tue Mar 16 03:16:18 EST 1999 | Scott Davies
| | Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probab
Electronics Forum | Mon Jun 07 17:58:12 EDT 2004 | Rob
UPDATE: Just for fun... I sacrificed a scrapped board to determine what remained and what fell and this is the result. Board dimension was 18"x9" and .9" thick. Components consist of hundreds of passives plus 386 proc (QFP256), TSOPs, SOLs 14/16/20,
