Electronics Forum | Tue Aug 01 09:56:22 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Wed Aug 09 09:43:31 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Thu Feb 17 09:52:48 EST 2000 | Alberto
Hi, Does anyone knows if there are any standards about passive smd components codification? Or each component manufacturer creates is own conding? Do they follow any rules? Thanks, Alberto
Electronics Forum | Thu Feb 17 09:52:48 EST 2000 | Alberto
Hi, Does anyone knows if there are any standards about passive smd components codification? Or each component manufacturer creates is own conding? Do they follow any rules? Thanks, Alberto
Electronics Forum | Tue Jun 15 14:45:11 EDT 1999 | C. Cross
| I am looking for more information about: | | 1) What kind of evaluation can I do to measure the resistance to fall off of a bottom side glueded SMT component?; | | 2) There is some influence of doble wave solder machine (temperature, flux, etc) i
Electronics Forum | Thu Feb 17 22:30:09 EST 2000 | Dave F
Alberto: There's no rules, but it works sorta like this: RESISTORS Usually marked in ohms using a standard code: First two numbers is the value Third number is the multiplier 102 = 1.0 x 10� ohm = 1000 ohm = 1 kW CAPACITOR Usually not marked. When
Electronics Forum | Thu Feb 17 22:30:09 EST 2000 | Dave F
Alberto: There's no rules, but it works sorta like this: RESISTORS Usually marked in ohms using a standard code: First two numbers is the value Third number is the multiplier 102 = 1.0 x 10� ohm = 1000 ohm = 1 kW CAPACITOR Usually not marked. When
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Tue Sep 23 09:18:45 EDT 2003 | russ
IPC SM 782 has some info on wave solder pad geometries. We usually like .03" spacing to any uncommon conductors. I would assume that you are seeing shorts between components and vias or adjacent parts? Russ
