Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Mon Apr 23 17:03:14 EDT 2007 | Theresa Spear
Thank you all for your feedback. Our backside are 99.9% with passive components. However, we do have a lot of through hole components on boards. To go totally selective soldering the equipment can be quite expensive. Most of the time, we left the com
Electronics Forum | Thu Mar 18 13:54:30 EST 1999 | John
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Thu Mar 18 17:18:22 EST 1999 | Earl Moon
| | Hi folks, | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and
Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
Electronics Forum | Sun Nov 12 21:28:09 EST 2000 | Rchard Eigner
We are manufacturing a PCB that uses an integrated circuit that has a leg spacing of 10 mils, other components on the PCB are 1206's and 0805's. Is it possible to make the stencil apertures 10 mils apart or is there another way of making the stencil.
Electronics Forum | Wed Aug 30 12:06:36 EDT 2000 | Luis Souto
For investigation purposes I need to find urgently these integrated circuits: RS ZN428 and RS 305-800. Where can I buy those components? Someone help me, please!
Electronics Forum | Mon Nov 15 12:01:21 EST 1999 | Michael Vyskocil
IRSI - Integrated Reliability Corporation? It seems they do'nt have a turnkey solution for post reflow inspection. I only found an inspection on component-(die)-level. Do you have any additional information? Michael
Electronics Forum | Tue Sep 10 08:01:47 EDT 2002 | mpotter
Kevin If you want to go automated then why not take a look at the Philips ACM. It is the flagship for placing SMT and Oddform packages. We use Vacuum nozzles and Grippers to handle many truly oddform components.
Electronics Forum | Thu Apr 06 13:33:10 EDT 2006 | marla
Hello Dougs: Have you tried stenciling solder paste to the BGA part itself. You will find this most helpful for your heat transfer and attachment integrity of the component in a Pb free process.
