Electronics Forum | Thu Jan 14 15:31:39 EST 1999 | jmc
I should have said "InterNepcon '97".... Sorry, I was off by one year...
Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Wed Jul 10 22:32:46 EDT 2002 | redmary
i just find the gap inside the component from the cross-section, it indeed exists the interal crack, not solder joint crack. but why the failed capacitor is well after some time. and the other suspicion is the quality of the component.
Electronics Forum | Thu May 22 22:26:01 EDT 2003 | ChrisX
Hi Guys, Sorry for asking stupid questions. Are SPC, PPM and DPMO related to each other? Do they affect each other then? What is their inter relations? Can someone explain to me what are their purposes? thanks
Electronics Forum | Thu Jan 15 09:04:36 EST 2004 | rkevin
Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?
Electronics Forum | Tue Feb 07 19:10:04 EST 2006 | GS
Hi, other effect could be the extra inter-metallic thickness that could compromise the solder joint reliability. just my 0.00001 Doblon Best regards.........GS
Electronics Forum | Thu Jan 14 15:29:16 EST 1999 | JMC
You pretty much hit the nail on the head Chrys. Reed runs a lot of exhibitions for a lot of different industries, and they do very well for themselves, probably too well. Right after InterNepcon Japan '96, the major equipment suppliers in Japan got
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Mon Jun 18 11:15:53 EDT 2001 | Gil Zweig
The cost of an x-ray inspection system will be determined by the following inter-related paramers: 1. The focal spot size of the x-ray source. 2. The maximum tube voltage. 3. The physical size and shielding requirements of the systems. 4. The design
Electronics Forum | Thu Nov 04 13:21:18 EST 1999 | Eric Maddy
Can anyone out there suggest a good computer network for a small EMS company. Basically I don't need it to be a huge setup ,just something basic that can handle all of my inter-office mail, company e-mail accounts and website setup. I also need this
.gif)
