Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Thu Jan 15 09:04:36 EST 2004 | rkevin
Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?
Electronics Forum | Tue Feb 07 19:10:04 EST 2006 | GS
Hi, other effect could be the extra inter-metallic thickness that could compromise the solder joint reliability. just my 0.00001 Doblon Best regards.........GS
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Mon Nov 13 18:36:32 EST 2023 | emeto
Your reflow profile should be designed towards the flux in your solder paste. To form a proper inter-metallic layer, you need to reach 20-30C above your melting point and stay in liquidus state for certain amount of time. SAC 105 has 3C difference fr
Electronics Forum | Fri Feb 20 12:04:29 EST 2009 | markhoch
Okay, after taking an actual minute to think about my suggestion, it has dawned on me that filling a metal cavity with molten solder to make a solder connection is not a good idea. By doing so I wouldn't be giving the metal cavity sufficient time to
Electronics Forum | Wed Oct 10 16:16:15 EDT 2001 | lisa
Hello all, I'm looking for some advice on inter-metallic formation. I have some circuit board finished with Immersion Tin, Immersion Silver and OSP. They have been reflowed with solder past and components,the joints look good. What can I expect fo
Electronics Forum | Wed Feb 15 09:00:46 EST 2006 | GS
if you look at the J-STD-033B, you will see that such a large PQFP could stay even longer the 24h at 125�C even if internally is already totally dry. It could be, the balls can get oxided and also IMC (Inter metallic compounds) could grow avery littl
Electronics Forum | Wed Mar 04 11:20:19 EST 2015 | jorge_quijano
Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different sa
Electronics Forum | Wed Dec 21 17:11:47 EST 2005 | Mike Dolbow www.atotalgps.com
Has any one considered the melting eutectic of the plated part verses the eutectic of the paste it self. Inter metallic solids can form when mixing metals. Thus this causes solder joint reliability. Also a lot of vendors are putting out pure tin prod
