Electronics Forum | Thu Jun 14 06:41:28 EDT 2007 | davef
No, raising the solder pot temperature to 800*F will not affect affect your solder alloy. We expect that you had a fairly high level of intermetallic compound generation, but most of that would be included in the fairly high dross generation that ha
Electronics Forum | Fri Feb 13 19:51:07 EST 2009 | joeherz
Update Received cross-section analysis for ENIG plated boards and am happy to report that we have no voiding issues. Intermetalics look great and no copper dissolution. No process parameters were changed, only the PCB plating. For now, we are onl
Electronics Forum | Fri Sep 17 07:33:56 EDT 2010 | scottp
Based on the last few pictures in the report, the root cause is lousy HASL. In fact, you don't have HASL - you've got SnCu intermetallic. Don't mess with your reflow profile, change paste, or monkey with anything else in your process. Have the boar
Electronics Forum | Thu Nov 08 10:52:22 EST 2012 | Bryan Ng
I am considering using high-temp ball Sn10Pb90 + eutectic solder paste for MLC reflow (no underfill). You can see that there is no Intermetallic bond for the paste and the balls. Under high stress/shock condition, the solder joints develop micro c
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Tue Sep 24 18:38:54 EDT 2019 | researchmfg
Well, there may be a misunderstanding that people think the IMC layer grows the thicker the more strong soldering strength. Actually, the IMC layer can be grown and distributed evenly at the interface between Cu-based, Ni-based and Sn-solder will be
Electronics Forum | Thu Dec 12 17:39:14 EST 2019 | davef
When I hear "pinholes" in solder connections, I think of two sources, depending on the situation, which can be either: + Entrapped air and process chemicals develop during reflow soldering to cause the pinholes in and around the intermetallic layer
Electronics Forum | Mon Jun 15 16:51:05 EDT 2020 | emeto
Tin/Lead has 183C melting point and probably around 220 peak temperature at reflow. Tin has 232C melting point. I would assume that based on this information you would understand why intermetallic joint is questionable. Go to any flat finish. HASL wi
Electronics Forum | Mon Nov 13 18:36:32 EST 2023 | emeto
Your reflow profile should be designed towards the flux in your solder paste. To form a proper inter-metallic layer, you need to reach 20-30C above your melting point and stay in liquidus state for certain amount of time. SAC 105 has 3C difference fr
Electronics Forum | Wed Aug 07 15:58:17 EDT 2024 | SMTA-64386252
Hello. Since a DFN is a BTC component, an end fillet height is not required on IPC 610 since most of these components did not have a wettable surface on the sides. A cross section in a non-touched up sample could be performed to validate the solder
